Vacuum packaging for microsensors by glass-silicon anodic bonding

H. Henmi*, S. Shoji, Y. Shoji, K. Yoshimi, M. Esashi

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

198 Citations (Scopus)


Vacuum packaging by the glass-silicon anodic process is studied. The residual gas generated during the anodic binding process and that desobed from the silicon and glass surface increase the pressure in a sealed cavity. In order to fabricate a vacuum sealed cavity, two methods are proposed to eliminate the residual gas; (i) the residual gases are evacuated through a small opening after bonding and then the opening is plugged by depositing a material in vacuum, (ii) the residual gases are absorbed by a getter inside the sealed cavity. A non-evaporable getter (NEG) is used for the second method. A vacuum sealing of tens of Torr is obtained by the firat method. The second method and a combnation of the two methids enables vacuum sealing at a pressure lower than 10-5Torr. A prototype of a capacitive vacuum sensor is fabricated by using the second method.

Original languageEnglish
Pages (from-to)243-248
Number of pages6
JournalSensors and Actuators: A. Physical
Issue number1-3
Publication statusPublished - 1994 May
Externally publishedYes

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Electrical and Electronic Engineering


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