Void-fraction measurement with high spatial resolution in a 5×5 rod bundle by linear-accelerator-driven X-ray computed tomography over a wide pressure range

Takahiro Arai*, Masahiro Furuya, Hiroki Takiguchi, Yoshihisa Nishi, Kenetsu Shirakawa

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

8 Citations (Scopus)

Abstract

Void fraction (i.e., the volume fraction occupied by gas) is a key parameter for determining the coolability and neutron-moderating performance of a water-cooled nuclear reactor. To develop computational multi-fluid dynamics models for determining the void-fraction distribution, experimental data of comparable quality are required. We have developed a high-energy X-ray computed tomography (CT) system to acquire three-dimensional void-fraction distributions. The CT system comprises a linear-accelerator-driven high-energy X-ray source and a linear detector array. We quantified a boiling two-phase flow in a 5 × 5 heated rod bundle at high pressure, simulating a fuel-rod bundle in a boiling water reactor (BWR). Because the axial travel of the CT system is 4 m and includes the entire BWR fuel-rod bundle, we optimized the CT imaging conditions and reconstruction method for rod-bundle visualization to reduce uncertainties due to density fluctuations in the boiling flow and imaging artifacts. We conducted a boiling experiment at a low flow rate and low thermal power and acquired three-dimensional distributions of the void fraction over a wide pressure range of 0.1–7.2 MPa. The experiment provided three-dimensional void-fraction distributions with high spatial resolution, especially in subchannel regions surrounded by rods, and the results are suitable for validating three-dimensional thermal-hydraulic analysis codes.

Original languageEnglish
Article number101614
JournalFlow Measurement and Instrumentation
Volume69
DOIs
Publication statusPublished - 2019 Oct
Externally publishedYes

ASJC Scopus subject areas

  • Modelling and Simulation
  • Instrumentation
  • Computer Science Applications
  • Electrical and Electronic Engineering

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