Wafer bonding of SiC-AlN at room temperature for all-SiC capacitive pressure sensor

Fengwen Mu, Yang Xu, Seongbin Shin, Yinghui Wang*, Hengyu Xu, Haiping Shang, Yechao Sun, Lei Yue, Tatsurou Tsuyuki, Tadatomo Suga, Weibing Wang, Dapeng Chen

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)

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Engineering & Materials Science