Fingerprint
Dive into the research topics of 'Wafer bonding of SiC-SiC and SiC-Si by modified suface activated bonding method'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Wafer bonding of SiC-SiC and SiC-Si by modified suface activated bonding method
Fengwen Mu, Masahisa Fujino, Tadatomo Suga, Yoshikazu Takahashi, Haruo Nakazawa, Kenichi Iguchi
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1
Citation
(Scopus)