マイクロギャップ電極デバイスを用いたシリカ/エポキシ界面の破壊経路の直接観察

Rina Sankawa; Takuya Onishi; Kohei Takahashi; Motohiro Tomita; Kotaro Mura; Takahiro Nakamura; Tetsuo Yoshimitsu; Takahiro Imai; Takanobu Watanabe

doi:10.1541/ieejfms.140.64

マイクロギャップ電極デバイスを用いたシリカ/エポキシ界面の破壊経路の直接観察

Rina Sankawa^*, Takuya Onishi, Kohei Takahashi, Motohiro Tomita, Kotaro Mura, Takahiro Nakamura, Tetsuo Yoshimitsu, Takahiro Imai, Takanobu Watanabe

^*この研究の対応する著者

基幹理工学部

研究成果: Article › 査読

抄録

We develop a micro-gap electrode device on quartz substrate to investigate the dielectric breakdown resistance on constrained layer of silica/epoxy interface. After application of stress, the device is cut at the middle of the micro-gap by laser dicing to observe the cross-section, and the cross-section shows where the breakdown occurs in the vicinity of the silica/epoxy interface at sub-micron scale. These results give us a clue to understand the effect of nano-fillers on the dielectric breakdown of nano-composite materials.

寄稿の翻訳タイトル	Direct observation of dielectric breakdown path at silica/epoxy interface with a micro-gap electrode device
本文言語	Japanese
ページ（範囲）	64-69
ページ数	6
ジャーナル	IEEJ Transactions on Fundamentals and Materials
巻	140
号	2
DOI	https://doi.org/10.1541/ieejfms.140.64
出版ステータス	Published - 2020

Keywords

Dielectric breakdown
Electrical treeing
Interface
Nano-composite
SEM
Silica

ASJC Scopus subject areas

電子工学および電気工学

文献へのアクセス

10.1541/ieejfms.140.64

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引用スタイル

@article{56f2d9fe44ab40eaab66f0bd172db27d,

title = "マイクロギャップ電極デバイスを用いたシリカ/エポキシ界面の破壊経路の直接観察",

abstract = "We develop a micro-gap electrode device on quartz substrate to investigate the dielectric breakdown resistance on constrained layer of silica/epoxy interface. After application of stress, the device is cut at the middle of the micro-gap by laser dicing to observe the cross-section, and the cross-section shows where the breakdown occurs in the vicinity of the silica/epoxy interface at sub-micron scale. These results give us a clue to understand the effect of nano-fillers on the dielectric breakdown of nano-composite materials.",

keywords = "Dielectric breakdown, Electrical treeing, Interface, Nano-composite, SEM, Silica",

author = "Rina Sankawa and Takuya Onishi and Kohei Takahashi and Motohiro Tomita and Kotaro Mura and Takahiro Nakamura and Tetsuo Yoshimitsu and Takahiro Imai and Takanobu Watanabe",

note = "Publisher Copyright: {\textcopyright} 2020 The Institute of Electrical Engineers of Japan.",

year = "2020",

doi = "10.1541/ieejfms.140.64",

language = "Japanese",

volume = "140",

pages = "64--69",

journal = "IEEJ Transactions on Fundamentals and Materials",

issn = "0385-4205",

publisher = "The Institute of Electrical Engineers of Japan",

number = "2",

}

TY - JOUR

T1 - マイクロギャップ電極デバイスを用いたシリカ/エポキシ界面の破壊経路の直接観察

AU - Sankawa, Rina

AU - Onishi, Takuya

AU - Takahashi, Kohei

AU - Tomita, Motohiro

AU - Mura, Kotaro

AU - Nakamura, Takahiro

AU - Yoshimitsu, Tetsuo

AU - Imai, Takahiro

AU - Watanabe, Takanobu

PY - 2020

Y1 - 2020

N2 - We develop a micro-gap electrode device on quartz substrate to investigate the dielectric breakdown resistance on constrained layer of silica/epoxy interface. After application of stress, the device is cut at the middle of the micro-gap by laser dicing to observe the cross-section, and the cross-section shows where the breakdown occurs in the vicinity of the silica/epoxy interface at sub-micron scale. These results give us a clue to understand the effect of nano-fillers on the dielectric breakdown of nano-composite materials.

AB - We develop a micro-gap electrode device on quartz substrate to investigate the dielectric breakdown resistance on constrained layer of silica/epoxy interface. After application of stress, the device is cut at the middle of the micro-gap by laser dicing to observe the cross-section, and the cross-section shows where the breakdown occurs in the vicinity of the silica/epoxy interface at sub-micron scale. These results give us a clue to understand the effect of nano-fillers on the dielectric breakdown of nano-composite materials.

KW - Dielectric breakdown

KW - Electrical treeing

KW - Interface

KW - Nano-composite

KW - SEM

KW - Silica

UR - http://www.scopus.com/inward/record.url?scp=85078843176&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85078843176&partnerID=8YFLogxK

U2 - 10.1541/ieejfms.140.64

DO - 10.1541/ieejfms.140.64

M3 - Article

AN - SCOPUS:85078843176

SN - 0385-4205

VL - 140

SP - 64

EP - 69

JO - IEEJ Transactions on Fundamentals and Materials

JF - IEEJ Transactions on Fundamentals and Materials

IS - 2

ER -

マイクロギャップ電極デバイスを用いたシリカ/エポキシ界面の破壊経路の直接観察

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Keywords

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