24-80 GHz, 0.024 mm2 miniaturized balun using defected ground structure for Si-based RF IC applications

Hang Xiao; Xin Yang; Toshihiko Yoshimasu

doi:10.1109/EDSSC.2014.7061228

24-80 GHz, 0.024 mm² miniaturized balun using defected ground structure for Si-based RF IC applications

Hang Xiao, Xin Yang, Toshihiko Yoshimasu

大学院情報生産システム研究科

研究成果: Conference contribution

抄録

A compact broadband balun on a silicon substrate is proposed for millimeter-wave applications. By utilizing a novel defected ground structure, it is expected that the balun exhibits an amplitude balance less than 0.5 dB and a phase balance less than 2 degrees in a frequency range from 26 GHz to 80 GHz. The insertion loss is less than 3 dB in the operational frequency band. The balun achieves a bandwidth of 108 % and the area occupies only 0.024 mm².

本文言語	English
ホスト出版物のタイトル	2014 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2014
出版社	Institute of Electrical and Electronics Engineers Inc.
ISBN（印刷版）	9781479923342
DOI	https://doi.org/10.1109/EDSSC.2014.7061228
出版ステータス	Published - 2014 3月 13
イベント	2014 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2014 - Chengdu, China 継続期間: 2014 6月 18 → 2014 6月 20

Other

Other	2014 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2014
国/地域	China
City	Chengdu
Period	14/6/18 → 14/6/20

ASJC Scopus subject areas

電子工学および電気工学
ハードウェアとアーキテクチャ

文献へのアクセス

10.1109/EDSSC.2014.7061228

他のファイルとリンク

引用スタイル

Xiao, H, Yang, X & Yoshimasu, T 2014, 24-80 GHz, 0.024 mm² miniaturized balun using defected ground structure for Si-based RF IC applications. in 2014 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2014., 7061228, Institute of Electrical and Electronics Engineers Inc., 2014 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2014, Chengdu, China, 14/6/18. https://doi.org/10.1109/EDSSC.2014.7061228

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