TY - GEN
T1 - 300 mA/mm Drain Current Density P-Type Enhancement-Mode Oxidized Si-terminated (111) Diamond MOSFETs with ALD Al2O3Gate Insulator
AU - Fu, Yu
AU - Chang, Yuhao
AU - Zhu, Xiaohua
AU - Hiraiwa, Atsushi
AU - Xu, Ruimin
AU - Xu, Yuehang
AU - Kawarada, Hiroshi
N1 - Funding Information:
ACKNOWLEDGMENT This work is supported in part by the scholarship from China Scholarship Council under Grant 201906070040 and in part by the National Natural Science Foundation of China under Grant 61922021.
Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - In this study, high-performance normally-off oxidized Si-terminated (C-Si) diamond metal-oxide- semiconductor field-effect transistors (MOSFETs) have been achieved using (111) diamond and Al2O3 gate insulator with maximum drain current density (ID_MAX) up to 300 mA/mm, which is a record value among Enhancement-mode single crystalline diamond devices to date. During selective growth of heavily-boron-doped (p++)-diamond MOSFETs utilizing a SiO2 mask, carbon-silicon bonding was established at SiO2/diamond interface. C-Si diamond MOSFET will be a promising candidate for fulfilling the requirements of high output capability and safety operation in some power device applications.
AB - In this study, high-performance normally-off oxidized Si-terminated (C-Si) diamond metal-oxide- semiconductor field-effect transistors (MOSFETs) have been achieved using (111) diamond and Al2O3 gate insulator with maximum drain current density (ID_MAX) up to 300 mA/mm, which is a record value among Enhancement-mode single crystalline diamond devices to date. During selective growth of heavily-boron-doped (p++)-diamond MOSFETs utilizing a SiO2 mask, carbon-silicon bonding was established at SiO2/diamond interface. C-Si diamond MOSFET will be a promising candidate for fulfilling the requirements of high output capability and safety operation in some power device applications.
KW - Diamond
KW - MOSFETs
KW - Normally-off
KW - Silicon
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U2 - 10.1109/ISPSD49238.2022.9813655
DO - 10.1109/ISPSD49238.2022.9813655
M3 - Conference contribution
AN - SCOPUS:85134207753
T3 - Proceedings of the International Symposium on Power Semiconductor Devices and ICs
SP - 121
EP - 124
BT - 2022 34th International Symposium on Power Semiconductor Devices and ICs, ISPSD 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 34th IEEE International Symposium on Power Semiconductor Devices and ICs, ISPSD 2022
Y2 - 22 May 2022 through 25 May 2022
ER -