3D integration of heterogeneous MEMS structures by stamping transfer

Hiroaki Onoe; Eiji Iwase; Kiyoshi Matsumoto; Isao Shimoyama

3D integration of heterogeneous MEMS structures by stamping transfer

Hiroaki Onoe^*, Eiji Iwase, Kiyoshi Matsumoto, Isao Shimoyama

^*この研究の対応する著者

研究成果: Conference contribution

8 被引用数 (Scopus)

抄録

We propose an integration method of heterogeneous micro-electro-mechanical- system (MEMS) structures by liftoff and stamping transfer using a poly-(dimethylsiloxane) (PDMS) sheet. Silicon structures fabricated on multiple wafers were lifted off by PDMS sheets, and integrated onto a single wafer by the stamping transfer with high yield (>90 %) and high accuracy (position error <500 nm). A two-dimensional (2D) integration and three-dimensional (3D) assembly of pyramid-like/inverted pyramid-like structures were demonstrated by our method. These demonstrations prove that our method enables us to integrate process-incompatible heterogeneous MEMS structures onto a single wafer.

本文言語	English
ホスト出版物のタイトル	Proceedings - CIS Workshops 2007, 2007 International Conference on Computational Intelligence and Security Workshops, CISW 2007
ページ	175-178
ページ数	4
出版ステータス	Published - 2007 12月 1
外部発表	はい
イベント	20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007 - Kobe, Japan 継続期間: 2007 1月 21 → 2007 1月 25

出版物シリーズ

名前	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN（印刷版）	1084-6999

Conference

Conference	20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007
国/地域	Japan
City	Kobe
Period	07/1/21 → 07/1/25

ASJC Scopus subject areas

電子材料、光学材料、および磁性材料
凝縮系物理学
機械工学
電子工学および電気工学

他のファイルとリンク

引用スタイル

Onoe, H., Iwase, E., Matsumoto, K., & Shimoyama, I. (2007). 3D integration of heterogeneous MEMS structures by stamping transfer. In Proceedings - CIS Workshops 2007, 2007 International Conference on Computational Intelligence and Security Workshops, CISW 2007 (pp. 175-178). [4433045] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

3D integration of heterogeneous MEMS structures by stamping transfer. / Onoe, Hiroaki; Iwase, Eiji; Matsumoto, Kiyoshi その他.
Proceedings - CIS Workshops 2007, 2007 International Conference on Computational Intelligence and Security Workshops, CISW 2007. 2007. p. 175-178 4433045 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

研究成果: Conference contribution

Onoe, H, Iwase, E, Matsumoto, K & Shimoyama, I 2007, 3D integration of heterogeneous MEMS structures by stamping transfer. in Proceedings - CIS Workshops 2007, 2007 International Conference on Computational Intelligence and Security Workshops, CISW 2007., 4433045, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), pp. 175-178, 20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007, Kobe, Japan, 07/1/21.

Onoe, Hiroaki ; Iwase, Eiji ; Matsumoto, Kiyoshi その他. / 3D integration of heterogeneous MEMS structures by stamping transfer. Proceedings - CIS Workshops 2007, 2007 International Conference on Computational Intelligence and Security Workshops, CISW 2007. 2007. pp. 175-178 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

@inproceedings{5c7e5b3eafaa4431a5ba8b54d6a11177,

title = "3D integration of heterogeneous MEMS structures by stamping transfer",

abstract = "We propose an integration method of heterogeneous micro-electro-mechanical- system (MEMS) structures by liftoff and stamping transfer using a poly-(dimethylsiloxane) (PDMS) sheet. Silicon structures fabricated on multiple wafers were lifted off by PDMS sheets, and integrated onto a single wafer by the stamping transfer with high yield (>90 %) and high accuracy (position error <500 nm). A two-dimensional (2D) integration and three-dimensional (3D) assembly of pyramid-like/inverted pyramid-like structures were demonstrated by our method. These demonstrations prove that our method enables us to integrate process-incompatible heterogeneous MEMS structures onto a single wafer.",

author = "Hiroaki Onoe and Eiji Iwase and Kiyoshi Matsumoto and Isao Shimoyama",

year = "2007",

month = dec,

day = "1",

language = "English",

isbn = "1424409519",

series = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

pages = "175--178",

booktitle = "Proceedings - CIS Workshops 2007, 2007 International Conference on Computational Intelligence and Security Workshops, CISW 2007",

note = "20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007 ; Conference date: 21-01-2007 Through 25-01-2007",

}

TY - GEN

T1 - 3D integration of heterogeneous MEMS structures by stamping transfer

AU - Onoe, Hiroaki

AU - Iwase, Eiji

AU - Matsumoto, Kiyoshi

AU - Shimoyama, Isao

PY - 2007/12/1

Y1 - 2007/12/1

N2 - We propose an integration method of heterogeneous micro-electro-mechanical- system (MEMS) structures by liftoff and stamping transfer using a poly-(dimethylsiloxane) (PDMS) sheet. Silicon structures fabricated on multiple wafers were lifted off by PDMS sheets, and integrated onto a single wafer by the stamping transfer with high yield (>90 %) and high accuracy (position error <500 nm). A two-dimensional (2D) integration and three-dimensional (3D) assembly of pyramid-like/inverted pyramid-like structures were demonstrated by our method. These demonstrations prove that our method enables us to integrate process-incompatible heterogeneous MEMS structures onto a single wafer.

AB - We propose an integration method of heterogeneous micro-electro-mechanical- system (MEMS) structures by liftoff and stamping transfer using a poly-(dimethylsiloxane) (PDMS) sheet. Silicon structures fabricated on multiple wafers were lifted off by PDMS sheets, and integrated onto a single wafer by the stamping transfer with high yield (>90 %) and high accuracy (position error <500 nm). A two-dimensional (2D) integration and three-dimensional (3D) assembly of pyramid-like/inverted pyramid-like structures were demonstrated by our method. These demonstrations prove that our method enables us to integrate process-incompatible heterogeneous MEMS structures onto a single wafer.

UR - http://www.scopus.com/inward/record.url?scp=50149106771&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=50149106771&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:50149106771

SN - 1424409519

SN - 9781424409518

T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

SP - 175

EP - 178

BT - Proceedings - CIS Workshops 2007, 2007 International Conference on Computational Intelligence and Security Workshops, CISW 2007

T2 - 20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007

Y2 - 21 January 2007 through 25 January 2007

ER -

3D integration of heterogeneous MEMS structures by stamping transfer

抄録

出版物シリーズ

Conference

ASJC Scopus subject areas

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