抄録
A novel cost-effective 60-GHz multi-chip module (MCM) is proposed and demonstrated. It is based on a low-cost multilayer printed wiring board (PWB) with a novel vertical transition and a single layer waveguide transition which enables the use of low-cost substrates with high dielectric loss for millimeter wave applications. The proposed MCM technology has been successfolly applied to the packaging of a 60-GHz self-heterodyne mixer, and no substantial difference in the RF performance is observed with the packaging.
| 本文言語 | English |
|---|---|
| ページ（範囲） | 2303-2305 |
| ページ数 | 3 |
| ジャーナル | Microwave and Optical Technology Letters |
| 巻 | 49 |
| 号 | 9 |
| DOI | |
| 出版ステータス | Published - 2007 9月 |
| 外部発表 | はい |
ASJC Scopus subject areas
- 電子材料、光学材料、および磁性材料
- 原子分子物理学および光学
- 凝縮系物理学
- 電子工学および電気工学