研究成果を検索

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• Conference contribution

  Low power consumption optical switches for high- to low-end applications

  Utaka, K., 2012 12月 1, 2012 International Conference on Photonics in Switching, PS 2012. 6608343. (2012 International Conference on Photonics in Switching, PS 2012).

  研究成果: Conference contribution

• Low power parallel encoding system for video surveillance applications

  Jin, X., Ba, K. & Goto, S., 2010, 2010 International SoC Design Conference, ISOCC 2010. p. 229-232 4 p. 5682929

  研究成果: Conference contribution
  1 被引用数 (Scopus)

• Low power parallel surveillance video encoding system based on joint power-speed scheduling

  Jin, X. & Goto, S., 2011, 2011 IEEE Visual Communications and Image Processing, VCIP 2011. 6115950

  研究成果: Conference contribution

• Low power surveillance video coding system

  Jin, X., Ba, K. & Goto, S., 2010, 2010 IEEE International Conference on Multimedia and Expo, ICME 2010. p. 1156-1157 2 p. 5583167

  研究成果: Conference contribution

• Low power test compression technique for designs with multiple scan chains

  Shi, Y., Togawa, N., Kimura, S., Yanagisawa, M. & Ohtsuki, T., 2005, Proceedings - 14th Asian Test Symposium, ATS 2005. p. 386-389 4 p. 1575460. (Proceedings of the Asian Test Symposium; vol. 2005).

  研究成果: Conference contribution
  13 被引用数 (Scopus)

• Low-power ultra-wideband power detector IC in 130 nm CMOS technology

  Yang, X., Uchida, Y., Liu, Q. & Yoshimasu, T., 2012 12月 20, IEEE MTT-S International Microwave Workshop Series on Millimeter Wave Wireless Technology and Applications, IMWS 2012 - Proceeding. p. 52-55 4 p. 6338206. (IEEE MTT-S International Microwave Workshop Series on Millimeter Wave Wireless Technology and Applications, IMWS 2012 - Proceeding).

  研究成果: Conference contribution
  3 被引用数 (Scopus)

• Low profile double resonance frequency tunable antenna using RF MEMS variable capacitor for digital terrestrial broadcasting reception

  Tsutsumi, Y., Nishio, M., Obayashi, S., Shoki, H., Ikehashi, T., Yamazaki, H., Ogawa, E., Saito, T., Ohguro, T. & Morooka, T., 2009, Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009. p. 125-128 4 p. 5357195. (Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009).

  研究成果: Conference contribution
  6 被引用数 (Scopus)

• Low-rankness of Complex-valued Spectrogram and Its Application to Phase-aware Audio Processing

  Masuyama, Y., Yatabe, K. & Oikawa, Y., 2019 5月, 2019 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2019 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 855-859 5 p. 8683100. (ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings; vol. 2019-May).

  研究成果: Conference contribution
  15 被引用数 (Scopus)

• Low-rank tensor completion: A Riemannian manifold preconditioning approach

  Kasai, H. & Mishra, B., 2016, 33rd International Conference on Machine Learning, ICML 2016. Weinberger, K. Q. & Balcan, M. F. (eds.). International Machine Learning Society (IMLS), p. 1576-1606 31 p. (33rd International Conference on Machine Learning, ICML 2016; vol. 3).

  研究成果: Conference contribution
  33 被引用数 (Scopus)

• Low resolution character recognition by dual eigenspace and synthetic degraded patterns

  Sun, J., Hotta, Y., Katsuyama, Y. & Naoi, S., 2004, HDP 2004: Proceedings of the First ACM Hardcopy Document Processing Workshop. Association for Computing Machinery (ACM), p. 15-22 8 p. (HDP 2004: Proceedings of the First ACM Hardcopy Document Processing Workshop).

  研究成果: Conference contribution
  1 被引用数 (Scopus)

• Low-Resource Contextual Topic Identification on Speech

  Liu, C., Wiesner, M., Watanabe, S., Harman, C., Trmal, J., Dehak, N. & Khudanpur, S., 2019 2月 11, 2018 IEEE Spoken Language Technology Workshop, SLT 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 656-663 8 p. 8639544. (2018 IEEE Spoken Language Technology Workshop, SLT 2018 - Proceedings).

  研究成果: Conference contribution
  1 被引用数 (Scopus)

• Low T/|W| dynamical instabilities in differentially rotating stars: Diagnosis with canonical angular momentum

  Saijo, M. & Yoshida, SI., 2006, AIP Conference Proceedings. Vol. 861. p. 728-735 8 p.

  研究成果: Conference contribution

• Low temperature, low pressure, fluxless and plateless Cu-Cu bonding by Cu nano particle transient liquid phase sintering

  Yamamoto, T., Faiz, M. K., Suga, T., Miyashita, T. & Yoshida, M., 2017 12月 26, 2017 IEEE CPMT Symposium Japan, ICSJ 2017. Institute of Electrical and Electronics Engineers Inc., p. 139-140 2 p. (2017 IEEE CPMT Symposium Japan, ICSJ 2017; vol. 2017-January).

  研究成果: Conference contribution
  1 被引用数 (Scopus)

• Low-temperature, surface-compliant wafer bonding using sub-micron gold particles for wafer-level MEMS packaging

  Ishida, H., Ogashiwa, T., Kanehira, Y., Ito, S., Yazaki, T. & Mizuno, J., 2012 10月 4, 2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012. p. 1140-1145 6 p. 6248979. (Proceedings - Electronic Components and Technology Conference).

  研究成果: Conference contribution
  9 被引用数 (Scopus)

• Low temperature all-Cu bonding via Cu-nanoparticle paste sintering in Pt-catalyzed formic acid vapor

  Mu, F., Ren, H., Shin, S., Masatake, A., Liu, L., Zou, G., Makoto, Y. & Suga, T., 2019 5月, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., p. 53 1 p. 8735224. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

  研究成果: Conference contribution

• Low temperature and low pressure bump bonding realized by single-micrometer Ag-nanoparticle bumps

  Fu, W., Kasahara, T., Okada, A., Shoji, S., Shigetou, A. & Mizuno, J., 2014 1月 1, Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014. IEEE Computer Society, 1 p. 6886186. (Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014).

  研究成果: Conference contribution

• Low temperature and low pressure fluxless Cu-Cu bonding by Ag-based transient liquid phase sintering for high temperature application

  Khairi Faiz, M., Yamamoto, T. & Yoshida, M., 2017 12月 26, 2017 IEEE CPMT Symposium Japan, ICSJ 2017. Institute of Electrical and Electronics Engineers Inc., p. 195-198 4 p. (2017 IEEE CPMT Symposium Japan, ICSJ 2017; vol. 2017-January).

  研究成果: Conference contribution

• Low-temperature anodic bonding of silicon and crystal quartz wafers for MEMS application

  Zimin, Y. & Ueda, T., 2010, Proceedings of IEEE Sensors. p. 269-272 4 p. 5689857

  研究成果: Conference contribution
  6 被引用数 (Scopus)

• Low temperature Au-Au bonding with VUV/O ₃ treatment

  Okada, A., Nimura, M., Unami, N., Shigetou, A., Noma, H., Sakuma, K., Mizuno, J. & Shoji, S., 2011, 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011. 6263015. (2011 IEEE International 3D Systems Integration Conference, 3DIC 2011).

  研究成果: Conference contribution

• Low temperature Au-Au flip chip bonding with VUV/O ₃ treatment for 3D integration

  Okada, A., Nimura, M., Unami, N., Shigetou, A., Noma, H., Sakuma, K., Shoji, S. & Mizuno, J., 2012, Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012. p. 171 1 p. 6238082. (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012).

  研究成果: Conference contribution
  1 被引用数 (Scopus)

• Low-temperature bonded glass-membrane microfluidic device for in vitro organ-on-a-chip cell culture models

  Pocock, K. J., Gao, X., Wang, C., Priest, C., Prestidge, C. A., Mawatari, K., Kitamori, T. & Thierry, B., 2015, Micro+Nano Materials, Devices, and Systems. Palomba, S. & Eggleton, B. J. (eds.). SPIE, 96680W. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 9668).

  研究成果: Conference contribution

• Low Temperature Bonding between Polyether Ether Ketone (PEEK) and Pt through Vapor Assisted VUV Surface Modification

  Fu, W., Shigetou, A., Shoji, S. & Mizuno, J., 2016 8月 16, Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., Vol. 2016-August. p. 2541-2546 6 p. 7545784

  研究成果: Conference contribution

• Low-temperature bonding of a LiNbO₃ waveguide chip to a Si substrate in ambient air for hybrid-integrated optical devices

  Takigawa, R., Higurashi, E., Suga, T., Shinada, S. & Kawanishi, T., 2006 12月 1, Optomechatronic Micro/Nano Devices and Components II. 637603. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 6376).

  研究成果: Conference contribution
  2 被引用数 (Scopus)

• Low temperature bonding process using mixed Cu-Ag nanoparticles for electronic packaging

  Zou, G., Yan, J., Wang, X., Mu, F., Bai, H., Wu, A., Hu, A. & Zhou, Y. N., 2011 12月 1, Materials Science and Technology Conference and Exhibition 2011, MS and T'11. p. 1532-1538 7 p. (Materials Science and Technology Conference and Exhibition 2011, MS and T'11; vol. 2).

  研究成果: Conference contribution

• Low temperature bonding using sub-micron Au particles for wafer-level MEMS packaging

  Ito, S., Mizuno, J., Ishida, H., Ogashiwa, T., Kanehira, Y., Murai, H., Wakai, F. & Shoji, S., 2012 12月 1, 2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012. 6523451. (2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012).

  研究成果: Conference contribution
  1 被引用数 (Scopus)

• Low temperature copper-copper quasi-direct bonding with ultrathin platinum intermediate layer using atomic layer deposition

  Yamada, K., Kuwae, H., Kamibayashi, T., Momose, W., Shoji, S. & Mizuno, J., 2019 1月 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 123-126 4 p. 8625756. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2018-October).

  研究成果: Conference contribution
  1 被引用数 (Scopus)

• Low temperature direct bonding of PEEK and Pt through VUV/FAB surface treatments

  Fu, W., Shigetou, A., Shoji, S. & Mizuno, J., 2016 6月 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 302-305 4 p. 7486834. (2016 International Conference on Electronics Packaging, ICEP 2016).

  研究成果: Conference contribution

• Low temperature direct bonding of polyether ether ketone (PEEK) and Pt

  Fu, W., Shigetou, A., Shoji, S. & Mizuno, J., 2015 12月 23, 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 217-220 4 p. 7365179

  研究成果: Conference contribution
  2 被引用数 (Scopus)

• Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM)

  Fu, W., Kuwae, H., Ma, B., Shoji, S. & Mizuno, J., 2017 6月 5, 2017 International Conference on Electronics Packaging, ICEP 2017. Institute of Electrical and Electronics Engineers Inc., p. 167-170 4 p. 7939349

  研究成果: Conference contribution

• Low temperature direct bonding of single crystal quartz substrates for high performance optical low pass filter using amorphous SiO2 intermediate layers

  Ma, B., Kuwae, H., Okada, A., Fu, W., Shoji, S. & Mizuno, J., 2016 2月 26, MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc., p. 25-28 4 p. 7421548. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); vol. 2016-February).

  研究成果: Conference contribution
  3 被引用数 (Scopus)

• Low-temperature gold-gold bonding using selective formation of nanoporous powders for bump interconnects

  Mimatsu, H., Mizuno, J., Kasahara, T., Saito, M., Shoji, S. & Nishikawa, H., 2014, MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc., p. 1131-1134 4 p. 6765845. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

  研究成果: Conference contribution
  7 被引用数 (Scopus)

• Low temperature Si homoepitaxy by a reactive CVD with a SiH ₄/F₂ mixture

  Minowa, A. & Kondo, M., 2009, Amorphous and Polycrystalline Thin-Film Silicon Science and Technology - 2009. Materials Research Society, p. 187-192 6 p. (Materials Research Society Symposium Proceedings; vol. 1153).

  研究成果: Conference contribution

• Low-temperature wafer bonding using sub-micron gold particles for wafer-level MEMS packaging

  Ishida, H., Ogashiwa, T., Kanehira, Y., Ito, S., Yazaki, T. & Mizuno, J., 2012 8月 15, Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012. 1 p. 6238083. (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012).

  研究成果: Conference contribution

• Low-voltage operation of 100-Gbit/s EADFB laser array module

  Kanazawa, S., Fujisawa, T., Ohki, A., Ishii, H., Nunoya, N., Kawaguchi, Y., Fujiwara, N., Takahata, K., Iga, R., Kano, F. & Oohashi, H., 2010 12月 1, 2010 22nd IEEE International Semiconductor Laser Conference, ISLC 2010. p. 57-58 2 p. 5642753. (Conference Digest - IEEE International Semiconductor Laser Conference).

  研究成果: Conference contribution
  3 被引用数 (Scopus)

• Low volume aerobic training heightens muscle deoxygenation in early post-angina pectoris patients

  Takagi, S., Murase, N., Kime, R., Niwayama, M., Osada, T. & Katsumura, T., 2016, Oxygen Transport to Tissue XXXVIII. Springer New York LLC, Vol. 923. p. 255-261 7 p. (Advances in Experimental Medicine and Biology; vol. 923).

  研究成果: Conference contribution

• LPE growth of low doped n-type 4H-SiC layer on on-axis substrate for power device application

  Hattori, R., Kamei, K., Kusunoki, K., Yashiro, N. & Shimosaki, S., 2009, Materials Science Forum. Vol. 615 617. p. 141-144 4 p. (Materials Science Forum; vol. 615 617).

  研究成果: Conference contribution
  2 被引用数 (Scopus)

• LQG control for systems with scheduling parameter

  Uchida, K., Watanabe, R. & Fujita, M., 2015 3月 24, European Control Conference, ECC 1999 - Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 367-372 6 p. 7099330. (European Control Conference, ECC 1999 - Conference Proceedings).

  研究成果: Conference contribution

• L-shaped Method for the Stochastic Vehicle Routing Problem

  Isomura, S., Sato, T., Shiina, T. & Imaizumi, J., 2019 12月, 2019 IEEE International Conference on Industrial Engineering and Engineering Management, IEEM 2019. IEEE Computer Society, p. 591-595 5 p. 8978752. (IEEE International Conference on Industrial Engineering and Engineering Management).

  研究成果: Conference contribution

• LSI DIGITAL SIGNAL PROCESSOR TAILORED TO VOICE SYNTHESIS.

  Tsuda, T., Murano, K., Shimada, M., Goto, G., Kikuchi, H., Baba, S., Kaneko, A. & Kanamori, T., 1981, Conference Record - International Conference on Communications. Piscataway, NJ, USA: IEEE, Vol. 4.

  研究成果: Conference contribution

• LSTM vs. BM25 for Open-domain QA: A hands-on comparison of effectiveness and efficiency

  Kato, S., Togashi, R., Maeda, H., Fujita, S. & Sakai, T., 2017 8月 7, SIGIR 2017 - Proceedings of the 40th International ACM SIGIR Conference on Research and Development in Information Retrieval. Association for Computing Machinery, Inc, p. 1309-1312 4 p. (SIGIR 2017 - Proceedings of the 40th International ACM SIGIR Conference on Research and Development in Information Retrieval).

  研究成果: Conference contribution
  2 被引用数 (Scopus)

• LT@Helsinki at SemEval-2020 Task 12: Multilingual or language-specific BERT?

  Pàmies, M., Öhman, E., Kajava, K. & Tiedemann, J., 2020, 14th International Workshops on Semantic Evaluation, SemEval 2020 - co-located 28th International Conference on Computational Linguistics, COLING 2020, Proceedings. Herbelot, A., Zhu, X., Palmer, A., Schneider, N., May, J. & Shutova, E. (eds.). International Committee for Computational Linguistics, p. 1569-1575 7 p. (14th International Workshops on Semantic Evaluation, SemEval 2020 - co-located 28th International Conference on Computational Linguistics, COLING 2020, Proceedings).

  研究成果: Conference contribution
  2 被引用数 (Scopus)

• Lubricant applying effect in stainless steel cutting

  Kaneeda, T., Okada, Y. & Laurence, A., 2004 12月 1, Progress of Machining Technology - Proceedings of the Seventh International Conference on Progress of Machining Technology, ICPMT'2004. Chen, W., Yamane, Y., Fan, R. & Ochi, A. (eds.). p. 163-168 6 p. (Progress of Machining Technology - Proceedings of the Seventh International Conference on Progress of Machining Technology, ICPMT'2004).

  研究成果: Conference contribution
  1 被引用数 (Scopus)

• Lubricant applying effect mechanism in Inconel 718 cutting - Effects of cutting speed and depth of cut

  Kaneeda, T., Ishioka, K., Anthony, L. & Goto, Y., 2011, Advances in Abrasive Technology XIV. p. 424-429 6 p. (Advanced Materials Research; vol. 325).

  研究成果: Conference contribution
  1 被引用数 (Scopus)

• Luminescent colloidal silicon nanocrystals prepared by nanoseconds laser fragmentation and laser ablation in water

  Svrcek, V., Mariotti, D., Hailstone, R., Fujiwara, H. & Kondo, M., 2008, Amorphous and Polycrystalline Thin-Film Silicon Science and Technology - 2008. Materials Research Society, p. 437-442 6 p. (Materials Research Society Symposium Proceedings; vol. 1066).

  研究成果: Conference contribution

• Luminosity determination in vs =7TeV proton Collisions Using the LHCf Front Counter at LHC

  Taki, K., Adriani, O., Bonechi, L., Bongi, M., Castellini, G., D'alessandro, R., Fukatsu, K., Haguenauer, M., Itow, Y., Kasahara, K., Kawade, K., Macina, D., Mase, T., Masuda, K., Menjo, H., Mitsuka, G., Muraki, Y., Noda, K., Papini, P., Perrot, A. L., & 9 othersRicciarini, S., Sako, T., Shimizu, Y., Suzuki, K., Suzuki, T., Tamura, T., Torii, S., Tricomi, A. & Turner, W. C., 2011, Proceedings of the 32nd International Cosmic Ray Conference, ICRC 2011. Institute of High Energy Physics, Vol. 5. p. 23-26 4 p.

  研究成果: Conference contribution
  1 被引用数 (Scopus)

• Luminosity enhancement in laser-compton scattering by crab crossing

  Koshiba, Y., Morita, R., Yamashita, K., Washio, M., Sakaue, K., Higashiguchi, T. & Urakawa, J., 2020 11月 16, Compact EUV and X-ray Light Sources, EUVXRAY 2020. The Optical Society, JM3A.4. (Optics InfoBase Conference Papers).

  研究成果: Conference contribution

• Luminosity increase in laser-Compton scattering by crab crossing

  Koshiba, Y., Takahashi, T., Ota, S., Washio, M., Sakaue, K., Higashiguchi, T. & Urakawa, J., 2017, Proceedings of the 38th International Free-Electron Laser Conference, FEL 2017. Bishofberger, K., Bruce, C. & Schaa, V. RW. (eds.). JACoW Publishing, p. 368-370 3 p. (Proceedings of the 38th International Free-Electron Laser Conference, FEL 2017).

  研究成果: Conference contribution

• Luminosity increase in laser-Compton scattering by CRAB crossing method

  Koshiba, Y., Igarashi, D., Takahashi, T., Ota, S., Washio, M., Sakaue, K. & Urakawa, J., 2017 7月, IPAC 2017 - Proceedings of the 8th International Particle Accelerator Conference. Joint Accelerator Conferences Website - JACoW, p. 902-904 3 p. (IPAC 2017 - Proceedings of the 8th International Particle Accelerator Conference).

  研究成果: Conference contribution

• Lunar capture trajectories in the four-body problem

  Onozaki, K. & Yoshimura, H., 2013, AIAA SPACE 2013 Conference and Exposition. American Institute of Aeronautics and Astronautics Inc., (AIAA SPACE 2013 Conference and Exposition).

  研究成果: Conference contribution
  2 被引用数 (Scopus)

• Lunar radiation dose due to cosmic rays and their secondary particles

  Hayatsu, K., Karouji, Y., Sihver, L. & Hasebe, N., 2010, 61st International Astronautical Congress 2010, IAC 2010. Vol. 5. p. 4084-4088 5 p.

  研究成果: Conference contribution