研究成果を検索

検索結果

• Conference contribution

  A 18.42 times faster video encoder based on Retinex theory

  Jin, X. & Goto, S., 2012, 2012 Picture Coding Symposium, PCS 2012, Proceedings. p. 473-476 4 p. 6213257

  研究成果: Conference contribution

• A-197.3 dBc/Hz FoMT wideband LC-VCO IC with an I-MOS based novel varactor in 40-nm SOI CMOS

  Fang, M., Kumura, A. & Yoshimasu, T., 2019 12月, Proceedings of the 2019 IEEE Asia-Pacific Microwave Conference, APMC 2019. Institute of Electrical and Electronics Engineers Inc., p. 783-785 3 p. 9038256. (Asia-Pacific Microwave Conference Proceedings, APMC; vol. 2019-December).

  研究成果: Conference contribution
  2 被引用数 (Scopus)

• A 1991 Mpixels/s intra prediction architecture for Super Hi-Vision H.264/AVC encoder

  He, G., Zhou, D., Zhou, J. & Goto, S., 2012, European Signal Processing Conference. p. 1054-1058 5 p. 6334062

  研究成果: Conference contribution

• A 1 Gbin/s CABAC encoder for H.264/AVC

  Fei, W., Zhou, D. & Goto, S., 2011, European Signal Processing Conference. p. 1524-1528 5 p.

  研究成果: Conference contribution
  21 被引用数 (Scopus)

• A 1-Mb STT-MRAM with zero-array standby power and 1.5-ns quick wake-up by 8-b fine-grained power gating

  Ohsawa, T., Ikeda, S., Hanyu, T., Ohno, H. & Endoh, T., 2013 9月 16, 2013 5th IEEE International Memory Workshop, IMW 2013. p. 80-83 4 p. 6582103. (2013 5th IEEE International Memory Workshop, IMW 2013).

  研究成果: Conference contribution
  5 被引用数 (Scopus)

• A 1pJ/cycle Processing Engine in LDPC application with charge recovery logic

  Zhang, Y., Huang, M., Wang, N., Goto, S. & Yoshihara, T., 2011, 2011 Proceedings of Technical Papers: IEEE Asian Solid-State Circuits Conference 2011, A-SSCC 2011. p. 213-216 4 p. 6123640

  研究成果: Conference contribution
  3 被引用数 (Scopus)

• A 2.17-pJ/b 5b-Response Attack-Resistant Strong PUF with Enhanced Statistical Performance

  Liu, K., Li, G., Fu, Z., Wang, X. & Shinohara, H., 2022, ESSCIRC 2022 - IEEE 48th European Solid State Circuits Conference, Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 513-516 4 p. (ESSCIRC 2022 - IEEE 48th European Solid State Circuits Conference, Proceedings).

  研究成果: Conference contribution
  1 被引用数 (Scopus)

• A 2.5-GHz 1-V high efficiency CMOS Class-E amplifier IC using back-gate voltage injection

  Kurniawan, T. A., Yang, X., Sun, Z., Xu, X. & Yoshimasu, T., 2014 3月 25, 2014 Asia-Pacific Microwave Conference Proceedings, APMC 2014. Institute of Electrical and Electronics Engineers Inc., p. 744-746 3 p. 7067771. (2014 Asia-Pacific Microwave Conference Proceedings, APMC 2014).

  研究成果: Conference contribution
  3 被引用数 (Scopus)

• A 2.5-GHz band, 0.75-V high efficiency CMOS power amplifier IC with third harmonic termination technique in 0.18-μm CMOS

  Kurniawan, T. A., Yang, X., Xu, X., Itoh, N. & Yoshimasu, T., 2015 6月 9, 2015 IEEE 16th Annual Wireless and Microwave Technology Conference, WAMICON 2015. Institute of Electrical and Electronics Engineers Inc., 7120389. (2015 IEEE 16th Annual Wireless and Microwave Technology Conference, WAMICON 2015).

  研究成果: Conference contribution
  1 被引用数 (Scopus)

• A 2.5-GHz band low-voltage class-E power amplifier IC for short-range wireless communications in 180-nm CMOS

  Xu, X., Sun, Z., Xu, K., Yang, X., Kurniawan, T. & Yoshimasu, T., 2014 10月 21, RFIT 2014 - 2014 IEEE International Symposium on Radio-Frequency Integration Technology: Silicon Technology Heats Up for THz. Institute of Electrical and Electronics Engineers Inc., 6933241. (RFIT 2014 - 2014 IEEE International Symposium on Radio-Frequency Integration Technology: Silicon Technology Heats Up for THz).

  研究成果: Conference contribution
  4 被引用数 (Scopus)

• A 2.5-GHz band low-voltage high efficiency class-E power amplifier IC with body effect

  Kurniawan, T. A., Yang, X., Xu, X., Sun, Z. & Yoshimasu, T., 2015 2月 2, Proceedings of the 14th International Symposium on Integrated Circuits, ISIC 2014. Institute of Electrical and Electronics Engineers Inc., p. 160-163 4 p. 7029483. (Proceedings of the 14th International Symposium on Integrated Circuits, ISIC 2014).

  研究成果: Conference contribution
  1 被引用数 (Scopus)

• A 2.5-GHz band low voltage high efficiency CMOS power amplifier IC using parallel switching transistor for short range wireless applications

  Kurniawan, T. A., Yang, X., Xu, X. & Yoshimasu, T., 2015 12月 2, European Microwave Week 2015: "Freedom Through Microwaves", EuMW 2015 - Conference Proceedings; 2015 45th European Microwave Conference Proceedings, EuMC. Institute of Electrical and Electronics Engineers Inc., p. 219-222 4 p. 7345739

  研究成果: Conference contribution
  4 被引用数 (Scopus)

• A 201.8-dBc/Hz-FoMT Octave-Tuning-Range LC-VCO IC with a Self-Shifted Voltage-Controlled Novel Varactor in 45-nm CMOS SOI

  Fang, M. & Yoshimasu, T., 2021, 2021 IEEE Asia-Pacific Microwave Conference, APMC 2021. Institute of Electrical and Electronics Engineers Inc., p. 238-240 3 p. (Asia-Pacific Microwave Conference Proceedings, APMC; vol. 2021-November).

  研究成果: Conference contribution

• A 20-30 GHz high efficiency power amplifier IC with an adaptive bias circuit in 130-nm SiGe BiCMOS

  Chen, C., Xu, X., Yang, X., Sugiura, T. & Yoshimasu, T., 2017 3月 8, SiRF 2017 - 2017 IEEE 17th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems. Institute of Electrical and Electronics Engineers Inc., p. 88-90 3 p. 7874379. (SiRF 2017 - 2017 IEEE 17th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems).

  研究成果: Conference contribution
  12 被引用数 (Scopus)

• A 210.4-dBc/Hz FoMT 67.9% Tuning Range LC-VCO IC with a Single Analog Voltage-Controlled Novel Varactor in 40-nm CMOS SOI

  Fang, M., Kumura, A. & Yoshimasu, T., 2021 8月 25, 2021 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2021. Institute of Electrical and Electronics Engineers Inc., (2021 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2021).

  研究成果: Conference contribution
  3 被引用数 (Scopus)

• A 22-30GHz balanced SiGe BiCMOS frequency doubler with 47dBc suppression and low input drive power

  Sun, J., Liu, Q., Suh, Y. J., Shibata, T. & Yoshimasu, T., 2009 12月 1, APMC 2009 - Asia Pacific Microwave Conference 2009. p. 2260-2263 4 p. 5385432. (APMC 2009 - Asia Pacific Microwave Conference 2009).

  研究成果: Conference contribution
  5 被引用数 (Scopus)

• A 24.5-53.6pJ/pixel 4320p 60fps H.264/AVC intra-frame video encoder chip in 65nm CMOS

  Zhou, D., He, G., Fei, W., Chen, Z., Zhou, J. & Goto, S., 2013, Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC. p. 73-74 2 p. 6509562

  研究成果: Conference contribution

• A 26-GHz-band high efficiency stacked-FET power amplifier ic with adaptively controlled load and bias circuits in 40-nm SOI CMOS

  Sugiura, T., Chen, C. & Yoshimasu, T., 2019 12月, Proceedings of the 2019 IEEE Asia-Pacific Microwave Conference, APMC 2019. Institute of Electrical and Electronics Engineers Inc., p. 1700-1702 3 p. 9038626. (Asia-Pacific Microwave Conference Proceedings, APMC; vol. 2019-December).

  研究成果: Conference contribution
  2 被引用数 (Scopus)

• A 28.1GHz ultra-low-power SHM with AC-DC spliting LC-tank and an analysis of the switch-conversion efficiency

  Wang, L. & Yoshimasu, T., 2017 12月 19, 2017 9th IEEE International Conference on Communication Software and Networks, ICCSN 2017. Institute of Electrical and Electronics Engineers Inc., Vol. 2017-January. p. 1520-1523 4 p.

  研究成果: Conference contribution

• A 280 GHz Circular Polarized 4x4 Elements Antenna Array

  Nishi, S., Tamesue, K., Myint, S. H., Sato, T. & Kawanishi, T., 2022, 2022 IEEE 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2022. Institute of Electrical and Electronics Engineers Inc., p. 132-136 5 p. (2022 IEEE 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2022).

  研究成果: Conference contribution

• A 28-GHz-Band Efficient Linear Power Amplifier with Novel Adaptive Bias Circuit for 5G Mobile Communications in 56-nm CMOS SOI

  Fang, M., Sugiura, T. & Yoshimasu, T., 2020 9月 20, 2020 IEEE MTT-S International Wireless Symposium, IWS 2020 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 9360109. (2020 IEEE MTT-S International Wireless Symposium, IWS 2020 - Proceedings).

  研究成果: Conference contribution

• A 28-GHz band highly linear power amplifier with novel adaptive bias circuit for cascode MOSFET in 56-nm SOI CMOS

  Sato, H., Yanagisawa, M. & Yoshimasu, T., 2017 12月 1, EDSSC 2017 - 13th IEEE International Conference on Electron Devices and Solid-State Circuits. Institute of Electrical and Electronics Engineers Inc., Vol. 2017-January. p. 1-2 2 p.

  研究成果: Conference contribution
  1 被引用数 (Scopus)

• A 28-GHz-band stacked FET linear power amplifier IC with 36.2 % PAE at 3-dB back-off from P1dB in 56-nm SOI CMOS

  Chen, C., Sugiura, T. & Yoshimasu, T., 2019 5月 14, 2019 IEEE Radio and Wireless Symposium, RWS 2019. IEEE Computer Society, 8714268. (IEEE Radio and Wireless Symposium, RWS).

  研究成果: Conference contribution
  3 被引用数 (Scopus)

• A 2-GHz-band low-phase-noise VCO IC with an LC bias circuit in 180-nm CMOS

  Xu, X., Yang, X. & Yoshimasu, T., 2016 12月 7, EuMIC 2016 - 11th European Microwave Integrated Circuits Conference. Institute of Electrical and Electronics Engineers Inc., p. 197-200 4 p. 7777524. (EuMIC 2016 - 11th European Microwave Integrated Circuits Conference).

  研究成果: Conference contribution
  5 被引用数 (Scopus)

• A 2Gpixel/s H.264/AVC HP/MVC video decoder chip for Super Hi-Vision and 3DTV/FTV applications

  Zhou, D., Zhou, J., Zhu, J., Liu, P. & Goto, S., 2012, Digest of Technical Papers - IEEE International Solid-State Circuits Conference. Vol. 55. p. 224-225 2 p. 6176985

  研究成果: Conference contribution
  19 被引用数 (Scopus)

• A 300GHz 40nm CMOS transmitter with 32-QAM 17.5Gb/s/ch capability over 6 channels

  Katayama, K., Takano, K., Amakawa, S., Hara, S., Kasamatsu, A., Mizuno, K., Takahashi, K., Yoshida, T. & Fujishima, M., 2016 2月 23, 2016 IEEE International Solid-State Circuits Conference, ISSCC 2016. Institute of Electrical and Electronics Engineers Inc., p. 342-343 2 p. 7418047. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 59).

  研究成果: Conference contribution
  64 被引用数 (Scopus)

• A 300-GHz 64-QAM CMOS transmitter with 21-Gb/s maximum per-channel data rate

  Takano, K., Katayama, K., Amakawa, S., Yoshida, T. & Fujishima, M., 2016 12月 7, EuMIC 2016 - 11th European Microwave Integrated Circuits Conference. Institute of Electrical and Electronics Engineers Inc., p. 193-196 4 p. 7777523. (EuMIC 2016 - 11th European Microwave Integrated Circuits Conference).

  研究成果: Conference contribution
  14 被引用数 (Scopus)

• A 30-GHz band high-efficiency Class-J power amplifier IC in 120-nm SiGe HBT technology

  Chen, C., Yang, X. & Yoshimasu, T., 2016 9月 27, RFIT 2016 - 2016 IEEE International Symposium on Radio-Frequency Integration Technology. Institute of Electrical and Electronics Engineers Inc., 7578122

  研究成果: Conference contribution
  2 被引用数 (Scopus)

• A 30-GHz band low-insertion loss and high-isolation SPDT switch IC in 120-nm SiGe HBT

  Chen, C., Tuo, F., Xu, X. & Yoshimasu, T., 2016 9月 27, RFIT 2016 - 2016 IEEE International Symposium on Radio-Frequency Integration Technology. Institute of Electrical and Electronics Engineers Inc., 7578134. (RFIT 2016 - 2016 IEEE International Symposium on Radio-Frequency Integration Technology).

  研究成果: Conference contribution
  3 被引用数 (Scopus)

• A 32Gbit/s 16QAM CMOS receiver in 300GHz band

  Hara, S., Katayama, K., Takano, K., Dong, R., Watanabe, I., Sekine, N., Kasamatsu, A., Yoshida, T., Amakawa, S. & Fujishima, M., 2017 10月 4, 2017 IEEE MTT-S International Microwave Symposium, IMS 2017. Institute of Electrical and Electronics Engineers Inc., p. 1703-1706 4 p. 8058969. (IEEE MTT-S International Microwave Symposium Digest).

  研究成果: Conference contribution
  60 被引用数 (Scopus)

• A 32×32 two-dimensional photodetector array using a-Si pin photodiodes and poly-Si TFTs integrated on a transparent substrate

  Okamura, M., Kimura, K., Shirai, S. & Yamauchi, N., 1992 1月 1, 1992 International Technical Digest on Electron Devices Meeting, IEDM 1992. Institute of Electrical and Electronics Engineers Inc., p. 685-688 4 p. 307452. (Technical Digest - International Electron Devices Meeting, IEDM; vol. 1992-December).

  研究成果: Conference contribution

• A 333MHz random cycle DRAM using the floating body cell

  Hatsuda, K., Fujita, K. & Ohsawa, T., 2005, Proceedings of the IEEE 2005 Custom Integrated Circuits Conference. Institute of Electrical and Electronics Engineers Inc., p. 259-262 4 p. 1568656. (Proceedings of the Custom Integrated Circuits Conference; vol. 2005).

  研究成果: Conference contribution
  7 被引用数 (Scopus)

• A 360Mbin/s CABAC decoder for H.264/AVC level 5.1 applications

  Hong, Y., Liu, P., Zhang, H., You, Z., Zhou, D. & Goto, S., 2009, 2009 International SoC Design Conference, ISOCC 2009. p. 71-74 4 p. 5423878

  研究成果: Conference contribution
  5 被引用数 (Scopus)

• A 373 F ² 2D Power-Gated EE SRAM Physically Unclonable Function with Dark-Bit Detection Technique

  Liu, K., Min, Y., Yang, X., Sun, H. & Shinohara, H., 2018 12月 14, 2018 IEEE Asian Solid-State Circuits Conference, A-SSCC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 161-164 4 p. 8579315. (2018 IEEE Asian Solid-State Circuits Conference, A-SSCC 2018 - Proceedings).

  研究成果: Conference contribution
  11 被引用数 (Scopus)

• A 38 ns 4 Mb DRAM with a battery back-up (BBU) mode

  Konishi, Y., Dosaka, K., Komatsu, T., Ionue, Y., Kumanoya, M., Tobita, Y., Genjyo, H., Nagatomo, M. & Yoshihara, T., 1990 7月, Digest of Technical Papers - IEEE International Solid-State Circuits Conference. Publ by IEEE, p. 230-231, 30

  研究成果: Conference contribution
  2 被引用数 (Scopus)

• A 3-Axis Catch-and-Release Gyroscope with Pantograph Vibration for Low-Power and Fast Start-Up Applications

  Yuzawa, A., Gando, R., Masunishi, K., Ogawa, E., Hiraga, H., Tomizawa, Y., Itakura, T. & Ikehashi, T., 2019 6月, 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII. Institute of Electrical and Electronics Engineers Inc., p. 430-433 4 p. 8808391. (2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII).

  研究成果: Conference contribution
  2 被引用数 (Scopus)

• A 3D block printer using toy bricks for various models

  Sugimoto, C., Maeda, Y., Maekawa, T. & Maruo, S., 2017 7月 1, 2017 13th IEEE Conference on Automation Science and Engineering, CASE 2017. IEEE Computer Society, p. 958-963 6 p. (IEEE International Conference on Automation Science and Engineering; vol. 2017-August).

  研究成果: Conference contribution
  2 被引用数 (Scopus)

• A 3-D metal-direct-printed, low-cost, and light hexagonal waveguide Ka-band branch line coupler

  Abe, M., Yukawa, H., Ushijima, Y., Nishimura, T., Yoneda, N. & Miyazaki, M., 2017 12月 19, European Microwave Week 2017: "A Prime Year for a Prime Event", EuMW 2017 - Conference Proceedings; 47th European Microwave Conference, EuMC 2017. Institute of Electrical and Electronics Engineers Inc., p. 188-191 4 p. (European Microwave Week 2017: "A Prime Year for a Prime Event", EuMW 2017 - Conference Proceedings; 47th European Microwave Conference, EuMC 2017; vol. 2017-January).

  研究成果: Conference contribution
  2 被引用数 (Scopus)

• A 3D sensing model and practical sensor placement based on coverage and cost evaluation

  Yang, J., Kamezaki, M., Iwata, H. & Sugano, S., 2015 10月 2, 2015 IEEE International Conference on Cyber Technology in Automation, Control and Intelligent Systems, IEEE-CYBER 2015. Institute of Electrical and Electronics Engineers Inc., p. 1-6 6 p. 7287900

  研究成果: Conference contribution
  6 被引用数 (Scopus)

• A 3-D vision system incorporating solid modeler and geometric reasoning

  Dohi, H. & Ishizuka, M., 1990, Proceedings - International Conference on Pattern Recognition. Piscataway, NJ, United States: Publ by IEEE, Vol. 1. p. 185-187 3 p.

  研究成果: Conference contribution

• A 3V operation RF MEMS variable capacitor using piezoelectric and electrostatic actuation with lithographical bending control

  Ikehashi, T., Ogawa, E., Yamazaki, H. & Ohguro, T., 2007 12月 1, TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems. p. 149-152 4 p. 4300093. (TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems).

  研究成果: Conference contribution
  1 被引用数 (Scopus)

• A 40 dB peak gain, wideband, low noise intermediate frequency (IF) amplifier

  Dong, R., Hara, S., Katayama, K., Takano, K., Watanabe, I., Sekine, N., Kasamatsu, A., Yoshida, T., Amakawa, S. & Fujishima, M., 2017 6月 28, 2017 Asia Pacific Microwave Conference, APMC 2017 - Proceedings. Pasya, I. (ed.). Institute of Electrical and Electronics Engineers Inc., p. 622-625 4 p. (Asia-Pacific Microwave Conference Proceedings, APMC).

  研究成果: Conference contribution
  1 被引用数 (Scopus)

• A 40 degree grid model for multiple 3D objects

  Yaku, T., Anzai, K., Miyadera, Y., Anada, K., Goto, T. & Yokota, K., 2016 5月 19, Proceedings - 2016 IEEE International Conference on Industrial Technology, ICIT 2016. Institute of Electrical and Electronics Engineers Inc., Vol. 2016-May. p. 1678-1683 6 p. 7475015

  研究成果: Conference contribution

• A 40-nm 8T SRAM with selective source line control of read bitlines and address preset structure

  Yoshimoto, S., Miyano, S., Takamiya, M., Shinohara, H., Kawaguchi, H. & Yoshimoto, M., 2013 11月 7, Proceedings of the IEEE 2013 Custom Integrated Circuits Conference, CICC 2013. Institute of Electrical and Electronics Engineers Inc., 6658537. (Proceedings of the Custom Integrated Circuits Conference).

  研究成果: Conference contribution
  2 被引用数 (Scopus)

• A 416-mW 32-Gbit/s 300-GHz CMOS receiver

  Hara, S., Katayama, K., Takano, K., Dong, R., Watanabe, I., Sekine, N., Kasamatsu, A., Yoshida, T., Amakawa, S. & Fujishima, M., 2017 9月 20, 2017 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2017. Institute of Electrical and Electronics Engineers Inc., p. 65-67 3 p. 8048291. (2017 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2017).

  研究成果: Conference contribution
  10 被引用数 (Scopus)

• A 41mW VGA@30fps quadtree video encoder for video surveillance systems

  Liu, Q., Hiratsuka, S., Goto, S. & Ikenaga, T., 2007 12月 1, ASICON 2007 - 2007 7th International Conference on ASIC Proceeding. p. 758-761 4 p. 4415741. (ASICON 2007 - 2007 7th International Conference on ASIC Proceeding).

  研究成果: Conference contribution

• A 4320MIPS four-processor core SMP/AMP with individually managed clock frequency for low power consumption

  Yoshida, Y., Kamei, T., Hayase, K., Shibahara, S., Nishii, O., Hattori, T., Hasegawa, A., Takada, M., Irie, N., Uchiyama, K., Odaka, T., Takada, K., Kimura, K. & Kasahara, H., 2007 9月 27, 2007 IEEE International Solid-State Circuits Conference, ISSCC - Digest of Technical Papers. p. 100-101+590+95 4242284. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference).

  研究成果: Conference contribution
  26 被引用数 (Scopus)

• A 4320p 60fps H.264/AVC intra-frame encoder chip with 1.41Gbins/s CABAC

  Zhou, D., He, G., Fei, W., Chen, Z., Zhou, J. & Goto, S., 2012, IEEE Symposium on VLSI Circuits, Digest of Technical Papers. p. 154-155 2 p. 6243836

  研究成果: Conference contribution
  9 被引用数 (Scopus)

• A 44.3% Peak PAE 25-GHz Stacked-FET Linear Power Amplifier IC with A Varactor-Based Novel Adaptive Load Circuit in 45 nm CMOS SOI

  Sugiura, T., Fang, M. & Yoshimasu, T., 2021, 2021 IEEE Asia-Pacific Microwave Conference, APMC 2021. Institute of Electrical and Electronics Engineers Inc., p. 181-183 3 p. (Asia-Pacific Microwave Conference Proceedings, APMC; vol. 2021-November).

  研究成果: Conference contribution
  1 被引用数 (Scopus)

• A 45nm 0.6V cross-point 8T SRAM with negative biased read/write assist

  Yabuuchi, M., Nii, K., Tsukamoto, Y., Ohbayashi, S., Nakase, Y. & Shinohara, H., 2009 11月 18, 2009 Symposium on VLSI Circuits. p. 158-159 2 p. 5205389. (IEEE Symposium on VLSI Circuits, Digest of Technical Papers).

  研究成果: Conference contribution
  69 被引用数 (Scopus)