TY - JOUR
T1 - A 0.5-V Hybrid SRAM Physically Unclonable Function Using Hot Carrier Injection Burn-In for Stability Reinforcement
AU - Liu, Kunyang
AU - Chen, Xinpeng
AU - Pu, Hongliang
AU - Shinohara, Hirofumi
N1 - Funding Information:
Manuscript received July 31, 2020; revised October 7, 2020; accepted October 27, 2020. Date of publication November 16, 2020; date of current version June 29, 2021. This paper was approved by Associate Editor Vivek De. This work was supported in part by ROHM Company Ltd., and in part by the VLSI Design and Education Center (VDEC), The University of Tokyo, in collaboration with Cadence Design Systems, Inc., and Mentor Graphics, Inc. (Corresponding author: Kunyang Liu.) The authors are with the Graduate School of Information, Production and Systems, Waseda University, Kitakyushu 808-0135, Japan (e-mail: konyo@fuji.waseda.jp; shinohara.hiro@waseda.jp).
Publisher Copyright:
© 1966-2012 IEEE.
PY - 2021/7
Y1 - 2021/7
N2 - This article introduces an SRAM-based physically unclonable function (PUF) that employs hybrid-mode operations in the enhancement-enhancement (EE) SRAM mode and CMOS SRAM mode to achieve both high native stability and low power. A data latching scheme based on the hybrid structure enables operations under low supply voltage (V_DD). Furthermore, the proposed hybrid SRAM PUF is compatible with hot carrier injection (HCI) burn-in stabilization, which can reinforce PUF stability to 100% without the requirements of bitcell redundancy, visible oxide damages, additional fabrication processes, helper data storage, or error-correcting code (ECC) circuits. The proposed PUF is fabricated in 130-nm standard CMOS, and the experimental results show that it achieves 0.29% native bit error rate (BER) at the nominal condition of 0.6 V/25 °C. The operating V_DD scales down to 0.5 V, with a core energy efficiency of 2.07 fJ/b. After HCI burn-in, no bit errors are found across all V_DD /temperature (VT) corners from 0.5 to 0.7 V and from -40 °C to 120 °C (5120 bits \times 500 evaluations tested at each condition). Long-term reliability is verified by using an accelerated aging test equivalent to approximately 21 years of operation, where the reinforced PUF shows no bit errors even at the worst VT corner of 0.5 V/120 °C during the test. The introduced hybrid SRAM PUF also passes all applicable NIST SP 800-22 randomness tests. It has a compact bitcell with an area of 497 F2.
AB - This article introduces an SRAM-based physically unclonable function (PUF) that employs hybrid-mode operations in the enhancement-enhancement (EE) SRAM mode and CMOS SRAM mode to achieve both high native stability and low power. A data latching scheme based on the hybrid structure enables operations under low supply voltage (V_DD). Furthermore, the proposed hybrid SRAM PUF is compatible with hot carrier injection (HCI) burn-in stabilization, which can reinforce PUF stability to 100% without the requirements of bitcell redundancy, visible oxide damages, additional fabrication processes, helper data storage, or error-correcting code (ECC) circuits. The proposed PUF is fabricated in 130-nm standard CMOS, and the experimental results show that it achieves 0.29% native bit error rate (BER) at the nominal condition of 0.6 V/25 °C. The operating V_DD scales down to 0.5 V, with a core energy efficiency of 2.07 fJ/b. After HCI burn-in, no bit errors are found across all V_DD /temperature (VT) corners from 0.5 to 0.7 V and from -40 °C to 120 °C (5120 bits \times 500 evaluations tested at each condition). Long-term reliability is verified by using an accelerated aging test equivalent to approximately 21 years of operation, where the reinforced PUF shows no bit errors even at the worst VT corner of 0.5 V/120 °C during the test. The introduced hybrid SRAM PUF also passes all applicable NIST SP 800-22 randomness tests. It has a compact bitcell with an area of 497 F2.
KW - Cryptography
KW - SRAM
KW - hardware security
KW - hot carrier injection (HCI)
KW - key generation
KW - low voltage
KW - physically unclonable function (PUF)
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U2 - 10.1109/JSSC.2020.3035207
DO - 10.1109/JSSC.2020.3035207
M3 - Article
AN - SCOPUS:85098788570
SN - 0018-9200
VL - 56
SP - 2193
EP - 2204
JO - IEEE Journal of Solid-State Circuits
JF - IEEE Journal of Solid-State Circuits
IS - 7
M1 - 9258950
ER -