A 137-mW, 4 ch × 25-Gbps low-power compact transmitter flip-chip-bonded 1.3-μm LD-array-on-Si

Toshiki Kishi; Munehiko Nagatani; Shigeru Kanazawa; Shinsuke Nakano; Hiroaki Katsurai; Takuro Fujii; Hidetaka Nishi; Takaaki Kakitsuka; Koichi Hasebe; Kota Shikama; Yuko Kawajiri; Atsushi Aratake; Hideyuki Nosaka; Hiroshi Fukuda; Shinji Matsuo

A 137-mW, 4 ch × 25-Gbps low-power compact transmitter flip-chip-bonded 1.3-μm LD-array-on-Si

Toshiki Kishi^*, Munehiko Nagatani, Shigeru Kanazawa, Shinsuke Nakano, Hiroaki Katsurai, Takuro Fujii, Hidetaka Nishi, Takaaki Kakitsuka, Koichi Hasebe, Kota Shikama, Yuko Kawajiri, Atsushi Aratake, Hideyuki Nosaka, Hiroshi Fukuda, Shinji Matsuo

^*この研究の対応する著者

研究成果: Conference contribution

4 被引用数 (Scopus)

抄録

A low-power compact 4-channel transmitter consisting of a 65-nm CMOS cascode shunt LD driver and flip-chip-bonded 1.3-μm LD-array-on-Si achieves 25-Gbps 2-km-long SSMF error-free operation for each channel, with power consumption of 1.37 mW/Gbps.

本文言語	English
ホスト出版物のタイトル	2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings
出版社	Institute of Electrical and Electronics Engineers Inc.
ページ	1-3
ページ数	3
ISBN（電子版）	9781943580385
出版ステータス	Published - 2018 6月 13
外部発表	はい
イベント	2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - San Diego, United States 継続期間: 2018 3月 11 → 2018 3月 15

出版物シリーズ

名前	2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings

Other

Other	2018 Optical Fiber Communications Conference and Exposition, OFC 2018
国/地域	United States
City	San Diego
Period	18/3/11 → 18/3/15

ASJC Scopus subject areas

コンピュータネットワークおよび通信
ハードウェアとアーキテクチャ
信号処理
電子材料、光学材料、および磁性材料
原子分子物理学および光学
電子工学および電気工学

他のファイルとリンク

引用スタイル

Kishi, T., Nagatani, M., Kanazawa, S., Nakano, S., Katsurai, H., Fujii, T., Nishi, H., Kakitsuka, T., Hasebe, K., Shikama, K., Kawajiri, Y., Aratake, A., Nosaka, H., Fukuda, H., & Matsuo, S. (2018). A 137-mW, 4 ch × 25-Gbps low-power compact transmitter flip-chip-bonded 1.3-μm LD-array-on-Si. In 2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings (pp. 1-3). (2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings). Institute of Electrical and Electronics Engineers Inc..

A 137-mW, 4 ch × 25-Gbps low-power compact transmitter flip-chip-bonded 1.3-μm LD-array-on-Si. / Kishi, Toshiki; Nagatani, Munehiko; Kanazawa, Shigeru その他.
2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2018. p. 1-3 (2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings).

研究成果: Conference contribution

Kishi, T, Nagatani, M, Kanazawa, S, Nakano, S, Katsurai, H, Fujii, T, Nishi, H, Kakitsuka, T, Hasebe, K, Shikama, K, Kawajiri, Y, Aratake, A, Nosaka, H, Fukuda, H & Matsuo, S 2018, A 137-mW, 4 ch × 25-Gbps low-power compact transmitter flip-chip-bonded 1.3-μm LD-array-on-Si. in 2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings. 2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings, Institute of Electrical and Electronics Engineers Inc., pp. 1-3, 2018 Optical Fiber Communications Conference and Exposition, OFC 2018, San Diego, United States, 18/3/11.

Kishi T, Nagatani M, Kanazawa S, Nakano S, Katsurai H, Fujii T その他. A 137-mW, 4 ch × 25-Gbps low-power compact transmitter flip-chip-bonded 1.3-μm LD-array-on-Si. In 2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2018. p. 1-3. (2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings).

Kishi, Toshiki ; Nagatani, Munehiko ; Kanazawa, Shigeru その他. / A 137-mW, 4 ch × 25-Gbps low-power compact transmitter flip-chip-bonded 1.3-μm LD-array-on-Si. 2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2018. pp. 1-3 (2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings).

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abstract = "A low-power compact 4-channel transmitter consisting of a 65-nm CMOS cascode shunt LD driver and flip-chip-bonded 1.3-μm LD-array-on-Si achieves 25-Gbps 2-km-long SSMF error-free operation for each channel, with power consumption of 1.37 mW/Gbps.",

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AU - Shikama, Kota

AU - Kawajiri, Yuko

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A 137-mW, 4 ch × 25-Gbps low-power compact transmitter flip-chip-bonded 1.3-μm LD-array-on-Si

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出版物シリーズ

Other

ASJC Scopus subject areas

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