A 3D sensing model and practical sensor placement based on coverage and cost evaluation

Junjie Yang*, Mitsuhiro Kamezaki, Hiroyasu Iwata, Shigeki Sugano

*この研究の対応する著者

研究成果: Conference contribution

6 被引用数 (Scopus)

抄録

This paper proposes a sensor model in three dimensional (3D) space, where the height of sensor above ground is variable and the position of sensor on the ground is limited. Traditional sensor models treat the sensor placement area as a film and there is no placement limits as well. As a consequence, the number of sensors is very large and the performance is not such ideal as simulation. In this paper, we develop a novel model for sensor placement, which makes sensors possible to be set at different height above ground, so that the coverage rate can be analyzed in 3D space and the simulation result can be more dependable. We also propose a corresponding 3D coverage rate evaluation method to be used for our proposed 3D model. In order to test our proposed model and evaluation method, the system is designed and numerical and graphical simulators are developed. Experiments are conducted to quantify trade-off relationship between coverage rate and cost, i.e., the number of sensors, which can make sensor placement strategy more practical. From the experimental results, we confirmed that the proposed 3D model and evaluation method is effective in a 3D space.

本文言語English
ホスト出版物のタイトル2015 IEEE International Conference on Cyber Technology in Automation, Control and Intelligent Systems, IEEE-CYBER 2015
出版社Institute of Electrical and Electronics Engineers Inc.
ページ1-6
ページ数6
ISBN(印刷版)9781479987290
DOI
出版ステータスPublished - 2015 10月 2
イベント5th Annual IEEE International Conference on Cyber Technology in Automation, Control and Intelligent Systems, IEEE-CYBER 2015 - Shenyang, China
継続期間: 2015 6月 92015 6月 12

Other

Other5th Annual IEEE International Conference on Cyber Technology in Automation, Control and Intelligent Systems, IEEE-CYBER 2015
国/地域China
CityShenyang
Period15/6/915/6/12

ASJC Scopus subject areas

  • 人工知能
  • 制御およびシステム工学

フィンガープリント

「A 3D sensing model and practical sensor placement based on coverage and cost evaluation」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル