抄録
A 0.5-mm-thick Cadmium Telluride (CdTe) semiconductor pixel sensor with 1024 pixels has been bump-bonded onto a two-dimensional (2-D) single photon counting pixel read out chip (MPEC 2.1) using a special gold-stud technique. The pixel size is 200 × 200 μm2, the active area is 6.4 × 6.4 mm2. The successful operation of this high-Z imaging pixel device is demonstrated. Noise and threshold dispersion as well as the imaging performance are reported.
本文言語 | English |
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ページ(範囲) | 2401-2404 |
ページ数 | 4 |
ジャーナル | IEEE Transactions on Nuclear Science |
巻 | 48 |
号 | 6 III |
DOI | |
出版ステータス | Published - 2001 12月 |
ASJC Scopus subject areas
- 電子工学および電気工学
- 原子力エネルギーおよび原子力工学