TY - JOUR
T1 - A novel hetero-junction Tunnel-FET using Semiconducting silicide-Silicon contact and its scalability
AU - Wu, Yan
AU - Hasegawa, Hiroyuki
AU - Kakushima, Kuniyuki
AU - Ohmori, Kenji
AU - Watanabe, Takanobu
AU - Nishiyama, Akira
AU - Sugii, Nobuyuki
AU - Wakabayashi, Hitoshi
AU - Tsutsui, Kazuo
AU - Kataoka, Yoshinori
AU - Natori, Kenji
AU - Yamada, Keisaku
AU - Iwai, Hiroshi
PY - 2014/5
Y1 - 2014/5
N2 - A new type of silicon-based Tunneling FET (TFET) using semiconducting silicide Mg2Si/Si hetero-junction as source-channel structure is proposed and the device simulation has been presented. With narrow bandgap of silicide and the conduction and valence band discontinuous at the hetero-junction, larger drain current and smaller subthreshold swing than those of Si homo-junction TFET can be obtained. Structural optimization study reveals that low Si channel impurity concentration and the alignment of the gate electrode edge to the hetero-junction lead to better performance of the TFET. Scaling of the gate length increases the off-state leakage current, however, the drain voltage (Vd) reduction in accordance with the gate scaling suppresses the phenomenon, keeping its high drivability.
AB - A new type of silicon-based Tunneling FET (TFET) using semiconducting silicide Mg2Si/Si hetero-junction as source-channel structure is proposed and the device simulation has been presented. With narrow bandgap of silicide and the conduction and valence band discontinuous at the hetero-junction, larger drain current and smaller subthreshold swing than those of Si homo-junction TFET can be obtained. Structural optimization study reveals that low Si channel impurity concentration and the alignment of the gate electrode edge to the hetero-junction lead to better performance of the TFET. Scaling of the gate length increases the off-state leakage current, however, the drain voltage (Vd) reduction in accordance with the gate scaling suppresses the phenomenon, keeping its high drivability.
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U2 - 10.1016/j.microrel.2014.01.023
DO - 10.1016/j.microrel.2014.01.023
M3 - Article
AN - SCOPUS:84899914029
SN - 0026-2714
VL - 54
SP - 899
EP - 904
JO - Microelectronics Reliability
JF - Microelectronics Reliability
IS - 5
ER -