A novel lift off process and its application for capacitive tilt sensor

Jinxing Liang; Fusao Kohsaka; Takahiro Matsuo; Toshitsugu Ueda

doi:10.1109/ICSENS.2007.355899

A novel lift off process and its application for capacitive tilt sensor

Jinxing Liang^*, Fusao Kohsaka, Takahiro Matsuo, Toshitsugu Ueda

^*この研究の対応する著者

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

This paper presents a novel bi-layer (top image resist Shipley S1808 and bottom liftoff resist LOL2000) lift off process for patterning 3-D devices. Resists are coated and patterned with an overhang profile on substrate before it is etched and before the film deposition. The key feature of the new lift off process is to create a resist undercut profile, which should be deep enough to reduce step coverage and durable to aggressive substrate etchant. Two-step development method was demonstrated effective. The resist profile is optimized by development time in the two step development process. Proposed lift off process was successively used for fabricating quartz based capacitive tilt sensor.

本文言語	English
ホスト出版物のタイトル	Proceedings of IEEE Sensors
ページ	1422-1425
ページ数	4
DOI	https://doi.org/10.1109/ICSENS.2007.355899
出版ステータス	Published - 2006
イベント	2006 5th IEEE Conference on Sensors - Daegu 継続期間: 2006 10月 22 → 2006 10月 25

Other

Other	2006 5th IEEE Conference on Sensors
City	Daegu
Period	06/10/22 → 06/10/25

ASJC Scopus subject areas

工学（その他）
電子工学および電気工学

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10.1109/ICSENS.2007.355899

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title = "A novel lift off process and its application for capacitive tilt sensor",

abstract = "This paper presents a novel bi-layer (top image resist Shipley S1808 and bottom liftoff resist LOL2000) lift off process for patterning 3-D devices. Resists are coated and patterned with an overhang profile on substrate before it is etched and before the film deposition. The key feature of the new lift off process is to create a resist undercut profile, which should be deep enough to reduce step coverage and durable to aggressive substrate etchant. Two-step development method was demonstrated effective. The resist profile is optimized by development time in the two step development process. Proposed lift off process was successively used for fabricating quartz based capacitive tilt sensor.",

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doi = "10.1109/ICSENS.2007.355899",

language = "English",

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note = "2006 5th IEEE Conference on Sensors ; Conference date: 22-10-2006 Through 25-10-2006",

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AU - Liang, Jinxing

AU - Kohsaka, Fusao

AU - Matsuo, Takahiro

AU - Ueda, Toshitsugu

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Y1 - 2006

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AB - This paper presents a novel bi-layer (top image resist Shipley S1808 and bottom liftoff resist LOL2000) lift off process for patterning 3-D devices. Resists are coated and patterned with an overhang profile on substrate before it is etched and before the film deposition. The key feature of the new lift off process is to create a resist undercut profile, which should be deep enough to reduce step coverage and durable to aggressive substrate etchant. Two-step development method was demonstrated effective. The resist profile is optimized by development time in the two step development process. Proposed lift off process was successively used for fabricating quartz based capacitive tilt sensor.

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DO - 10.1109/ICSENS.2007.355899

M3 - Conference contribution

AN - SCOPUS:50149119272

SN - 1424403766

SN - 9781424403769

SP - 1422

EP - 1425

BT - Proceedings of IEEE Sensors

T2 - 2006 5th IEEE Conference on Sensors

Y2 - 22 October 2006 through 25 October 2006

ER -

A novel lift off process and its application for capacitive tilt sensor

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