TY - GEN
T1 - A sorting-based micro-bump assignment for 3D ICs
AU - Zhang, Ran
AU - Pan, Tieyuan
AU - Watanabe, Takahiro
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2016/2/8
Y1 - 2016/2/8
N2 - Recently RDLs (Re-Distribution Layers) and micro-bumps are widely adopted in 3D IC designs. In this research, a sorting-based micro-bump assignment method is proposed. The approach initially assigns the I/O pads to micro-bumps by sorting the Manhattan distance between them. Then single layer routing in two RDLs are carried out respectively. The experimental results show that the proposed method is able to obtain the routes with shorter total wire length in reasonable CPU times.
AB - Recently RDLs (Re-Distribution Layers) and micro-bumps are widely adopted in 3D IC designs. In this research, a sorting-based micro-bump assignment method is proposed. The approach initially assigns the I/O pads to micro-bumps by sorting the Manhattan distance between them. Then single layer routing in two RDLs are carried out respectively. The experimental results show that the proposed method is able to obtain the routes with shorter total wire length in reasonable CPU times.
KW - 3D IC
KW - RDL routing
KW - micro-bump assignment
UR - http://www.scopus.com/inward/record.url?scp=84963830881&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84963830881&partnerID=8YFLogxK
U2 - 10.1109/ISOCC.2015.7401697
DO - 10.1109/ISOCC.2015.7401697
M3 - Conference contribution
AN - SCOPUS:84963830881
T3 - ISOCC 2015 - International SoC Design Conference: SoC for Internet of Everything (IoE)
SP - 139
EP - 140
BT - ISOCC 2015 - International SoC Design Conference
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 12th International SoC Design Conference, ISOCC 2015
Y2 - 2 November 2015 through 5 November 2015
ER -