抄録
Recently RDLs (Re-Distribution Layers) and micro-bumps are widely adopted in 3D IC designs. In this research, a sorting-based micro-bump assignment method is proposed. The approach initially assigns the I/O pads to micro-bumps by sorting the Manhattan distance between them. Then single layer routing in two RDLs are carried out respectively. The experimental results show that the proposed method is able to obtain the routes with shorter total wire length in reasonable CPU times.
本文言語 | English |
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ホスト出版物のタイトル | ISOCC 2015 - International SoC Design Conference: SoC for Internet of Everything (IoE) |
出版社 | Institute of Electrical and Electronics Engineers Inc. |
ページ | 139-140 |
ページ数 | 2 |
ISBN(印刷版) | 9781467393089 |
DOI | |
出版ステータス | Published - 2016 2月 8 |
イベント | 12th International SoC Design Conference, ISOCC 2015 - Gyeongju, Korea, Republic of 継続期間: 2015 11月 2 → 2015 11月 5 |
Other
Other | 12th International SoC Design Conference, ISOCC 2015 |
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国/地域 | Korea, Republic of |
City | Gyeongju |
Period | 15/11/2 → 15/11/5 |
ASJC Scopus subject areas
- ハードウェアとアーキテクチャ
- 電子工学および電気工学
- 電子材料、光学材料、および磁性材料