A theoretical study of thermal stress for engineering applications

Mrinal Bhowmik*, Payai Banerjee, Manoj Kumar Bhowmik

*この研究の対応する著者

研究成果: Chapter

抄録

The stress generated due to the temperature difference is called thermal stress. Generally, the temperature gradients, thermal shocks, and thermal expansion or contraction are most effective contributors to thermal stress. The improper temperature profile of a body results in the formation of cracks, fractures, or plastic deformations at single or multiple spots depending upon two factors (i.e., the magnitude of temperature distribution or other variables of heating and material properties). So, this chapter analyses the causes of thermal stress and their measurement techniques. However, as most of the engineering problems, the thermal stress is due to the thermal expansion or sudden temperature changes happening in the body. Therefore, a brief analysis of temperature measurement devices with their proper data capturing methodology is also discussed.

本文言語English
ホスト出版物のタイトルApplications and Techniques for Experimental Stress Analysis
出版社IGI Global
ページ176-201
ページ数26
ISBN(電子版)9781799816911
ISBN(印刷版)9781799816904
DOI
出版ステータスPublished - 2019 12月 27
外部発表はい

ASJC Scopus subject areas

  • 材料科学(全般)

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