A via hole based superconducting wiring method for enhanced X-ray image sensors

H. Kudo; S. Ohtsuka; T. Arakawa; T. Izumi; S. Shoji; H. Sato; H. Kobayashi; K. Mori; T. Homma; T. Osaka; K. Mitsuda; N. Y. Yamasaki; R. Fujimoto; N. Iyomoto; T. Oshima; K. Futamoto; Y. Takei; T. Ichitsubo; T. Fujimori; Y. Ishisaki; U. Morita; T. Koga; K. Sato; T. Ohashi; Y. Kuroda; M. Onishi; K. Otake

doi:10.1109/IMNC.2003.1268635

A via hole based superconducting wiring method for enhanced X-ray image sensors

H. Kudo, S. Ohtsuka, T. Arakawa, T. Izumi, S. Shoji, H. Sato, H. Kobayashi, K. Mori, T. Homma, T. Osaka, K. Mitsuda, N. Y. Yamasaki, R. Fujimoto, N. Iyomoto, T. Oshima, K. Futamoto, Y. Takei, T. Ichitsubo, T. Fujimori, Y. IshisakiU. Morita, T. Koga, K. Sato, T. Ohashi, Y. Kuroda, M. Onishi, K. Otake

先進理工学部

研究成果: Conference contribution

抄録

In this paper we developed through-wafer interconnections using only a simple fabrication process. The interconnection was successfully transformed into the superconducting state. A current density of 13 cm/sup 2//mA was obtained in the superconducting state. We realize high energy-resolution X-ray imaging using the superconducting through-wafer interconnections.

本文言語	English
ホスト出版物のタイトル	Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003
出版社	Institute of Electrical and Electronics Engineers Inc.
ページ	182-183
ページ数	2
ISBN（電子版）	4891140402, 9784891140403
DOI	https://doi.org/10.1109/IMNC.2003.1268635
出版ステータス	Published - 2003
イベント	International Microprocesses and Nanotechnology Conference, MNC 2003 - Tokyo, Japan 継続期間: 2003 10月 29 → 2003 10月 31

出版物シリーズ

名前	Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003

Other

Other	International Microprocesses and Nanotechnology Conference, MNC 2003
国/地域	Japan
City	Tokyo
Period	03/10/29 → 03/10/31

ASJC Scopus subject areas

ハードウェアとアーキテクチャ
電子工学および電気工学

文献へのアクセス

10.1109/IMNC.2003.1268635

他のファイルとリンク

引用スタイル

Kudo, H., Ohtsuka, S., Arakawa, T., Izumi, T., Shoji, S., Sato, H., Kobayashi, H., Mori, K., Homma, T., Osaka, T., Mitsuda, K., Yamasaki, N. Y., Fujimoto, R., Iyomoto, N., Oshima, T., Futamoto, K., Takei, Y., Ichitsubo, T., Fujimori, T., ... Otake, K. (2003). A via hole based superconducting wiring method for enhanced X-ray image sensors. In Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003 (pp. 182-183). Article 1268635 (Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IMNC.2003.1268635

A via hole based superconducting wiring method for enhanced X-ray image sensors. / Kudo, H.; Ohtsuka, S.; Arakawa, T. その他.
Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003. Institute of Electrical and Electronics Engineers Inc., 2003. p. 182-183 1268635 (Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003).

研究成果: Conference contribution

Kudo, H, Ohtsuka, S, Arakawa, T, Izumi, T, Shoji, S, Sato, H, Kobayashi, H, Mori, K, Homma, T, Osaka, T, Mitsuda, K, Yamasaki, NY, Fujimoto, R, Iyomoto, N, Oshima, T, Futamoto, K, Takei, Y, Ichitsubo, T, Fujimori, T, Ishisaki, Y, Morita, U, Koga, T, Sato, K, Ohashi, T, Kuroda, Y, Onishi, M & Otake, K 2003, A via hole based superconducting wiring method for enhanced X-ray image sensors. in Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003., 1268635, Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003, Institute of Electrical and Electronics Engineers Inc., pp. 182-183, International Microprocesses and Nanotechnology Conference, MNC 2003, Tokyo, Japan, 03/10/29. https://doi.org/10.1109/IMNC.2003.1268635

Kudo H, Ohtsuka S, Arakawa T, Izumi T, Shoji S, Sato H その他. A via hole based superconducting wiring method for enhanced X-ray image sensors. In Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003. Institute of Electrical and Electronics Engineers Inc. 2003. p. 182-183. 1268635. (Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003). doi: 10.1109/IMNC.2003.1268635

Kudo, H. ; Ohtsuka, S. ; Arakawa, T. その他. / A via hole based superconducting wiring method for enhanced X-ray image sensors. Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003. Institute of Electrical and Electronics Engineers Inc., 2003. pp. 182-183 (Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003).

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title = "A via hole based superconducting wiring method for enhanced X-ray image sensors",

abstract = "In this paper we developed through-wafer interconnections using only a simple fabrication process. The interconnection was successfully transformed into the superconducting state. A current density of 13 cm/sup 2//mA was obtained in the superconducting state. We realize high energy-resolution X-ray imaging using the superconducting through-wafer interconnections.",

author = "H. Kudo and S. Ohtsuka and T. Arakawa and T. Izumi and S. Shoji and H. Sato and H. Kobayashi and K. Mori and T. Homma and T. Osaka and K. Mitsuda and Yamasaki, {N. Y.} and R. Fujimoto and N. Iyomoto and T. Oshima and K. Futamoto and Y. Takei and T. Ichitsubo and T. Fujimori and Y. Ishisaki and U. Morita and T. Koga and K. Sato and T. Ohashi and Y. Kuroda and M. Onishi and K. Otake",

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AU - Kudo, H.

AU - Ohtsuka, S.

AU - Arakawa, T.

AU - Izumi, T.

AU - Shoji, S.

AU - Sato, H.

AU - Kobayashi, H.

AU - Mori, K.

AU - Homma, T.

AU - Osaka, T.

AU - Mitsuda, K.

AU - Yamasaki, N. Y.

AU - Fujimoto, R.

AU - Iyomoto, N.

AU - Oshima, T.

AU - Futamoto, K.

AU - Takei, Y.

AU - Ichitsubo, T.

AU - Fujimori, T.

AU - Ishisaki, Y.

AU - Morita, U.

AU - Koga, T.

AU - Sato, K.

AU - Ohashi, T.

AU - Kuroda, Y.

AU - Onishi, M.

AU - Otake, K.

PY - 2003

Y1 - 2003

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AB - In this paper we developed through-wafer interconnections using only a simple fabrication process. The interconnection was successfully transformed into the superconducting state. A current density of 13 cm/sup 2//mA was obtained in the superconducting state. We realize high energy-resolution X-ray imaging using the superconducting through-wafer interconnections.

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BT - Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - International Microprocesses and Nanotechnology Conference, MNC 2003

Y2 - 29 October 2003 through 31 October 2003

ER -

A via hole based superconducting wiring method for enhanced X-ray image sensors

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