抄録
The progress of optical communication systems has been supported greatly by the packaging technology of optical components and devices. The mainstream packaging technique has been to skillfully miniaturize the optical system on an optical bench into a package, and this has been made possible by microoptic elements and fine adjustment of the optical axis and positions. With the advent of the 90s, radical technological innovations are required for optical packaging. In view of this, significant improvements and proposed novel solutions that have appeared in recent years are reviewed.
| 本文言語 | English |
|---|---|
| ページ（範囲） | 28-40 |
| ページ数 | 13 |
| ジャーナル | Electronics and Communications in Japan, Part II: Electronics (English translation of Denshi Tsushin Gakkai Ronbunshi) |
| 巻 | 78 |
| 号 | 1 |
| 出版ステータス | Published - 1995 1月 |
| 外部発表 | はい |
ASJC Scopus subject areas
- 電子工学および電気工学