抄録
Extensively used in electronics application are electroplating and electroless-plating methods. The printed wiring boards (PWB), in order to raise the packing density, uses both techniques to employ higher multi-layer and higher surface density. Described in the paper is advanced surface finishing in electronics application. Plating technique has become an important key technology in this field. Its increased usage and applications are seen to take place in the future.
| 本文言語 | English |
|---|---|
| ページ | 421-424 |
| ページ数 | 4 |
| 出版ステータス | Published - 1993 12月 1 |
| イベント | Proceedings of the 80th AESF Annual Technical Conference - Anaheim, CA, USA 継続期間: 1993 6月 21 → 1993 6月 24 |
Other
| Other | Proceedings of the 80th AESF Annual Technical Conference |
|---|---|
| City | Anaheim, CA, USA |
| Period | 93/6/21 → 93/6/24 |
ASJC Scopus subject areas
- 機械工学
- 金属および合金