An efficient multi-level algorithm for 3D-IC TSV assignment

Cong Hao, Takeshi Yoshimura

研究成果: Article査読

5 被引用数 (Scopus)


Through-silicon via (TSV) assignment problem is one of the key design challenges of 3-D IC which is crucial to the wire length and signal delay. In this work we formulate the 3-D IC TSV assignment as an Integer Minimum Cost Multi Commodity (IMCMC) problem on a IMCMC network, and propose a multi-level algorithm. It coarsens the IMCMC network level by level, applies a rough flow assignment on each level of coarsened graph, and generates only promising edges to reduce the IMCMC network size. Benefiting from the multi-level structure, we propose a mixed single and multi commodity flow method improve the TSV assignment solution quality. Moreover, given a TSV assignment, we propose an extended layer by layer algorithm to further optimize the TSV assignment. The experimental results demonstrate that our multi-level with mixed single and multi commodity flow algorithm achieves not only smaller wire length but also shorter runtime compared to other existing works.

ジャーナルIEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences
出版ステータスPublished - 2017 3月 1

ASJC Scopus subject areas

  • 信号処理
  • コンピュータ グラフィックスおよびコンピュータ支援設計
  • 応用数学
  • 電子工学および電気工学


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