抄録
A 4.2-µm2 stacked capacitor DRAM cell is achieved using conventional i-line photolithography that realizes 0.6-µm pattern delineation. In order to obtain sufficient stored charge for memory operation, self-aligned plate-isolation technology, a novel pattern enlargement method named peripherally added resist lithography (PEARL), and a highly reliable ultrathin capacitor dielectric film are developed. These new technologies enable a stored charge of 25 fF/bit (41 fC/bit) in the present cell. Charge-retention characteristics and alpha-particle immunity are favorable, indicating that this cell is a good candidate for application to 16-Mbit DRAM’s.
本文言語 | English |
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ページ(範囲) | 1591-1595 |
ページ数 | 5 |
ジャーナル | IEEE Transactions on Electron Devices |
巻 | 35 |
号 | 10 |
DOI | |
出版ステータス | Published - 1988 |
外部発表 | はい |
ASJC Scopus subject areas
- 電子工学および電気工学
- 電子材料、光学材料、および磁性材料