TY - GEN
T1 - An Origami-Structured Flexible Electronic Substrate with Faces Parallel to Target-of-Attachment Surfaces
AU - Yasuga, Hiroki
AU - Eda, Atsushi
AU - Suto, Kai
AU - Tachi, Tomohiro
AU - Iwase, Eiji
N1 - Funding Information:
This work was partially supported by JSPS KAKENHI Grant Number 18H03868 and “EarlyBird” grant for young researcher at Waseda Research Institute for Science and Engineering.
Publisher Copyright:
© 2020 IEEE.
PY - 2020/1
Y1 - 2020/1
N2 - We propose a flexible electronic substrate structured by Origami folding of non-stretchable film with faces parallel to target-of-attachment surfaces. A folding ('Origami') or cutting ('Kirigami') of a thin film have opened up the application of non-stretchable materials to flexible electronic devices attached to a curved surface. In this paper, we propose origami-structured flexible electronic substrates which have faces parallel to the target-of-attachment surface. The parallel faces have engineering importance and usefulness for taking direct contact with target-of-attachment surfaces and mounting electronic elements, e.g. sensors or light emitters. These characteristics are expected to allow for the realization of flexible devices capable of sensing shear force or flow velocity parallel to object's surfaces.
AB - We propose a flexible electronic substrate structured by Origami folding of non-stretchable film with faces parallel to target-of-attachment surfaces. A folding ('Origami') or cutting ('Kirigami') of a thin film have opened up the application of non-stretchable materials to flexible electronic devices attached to a curved surface. In this paper, we propose origami-structured flexible electronic substrates which have faces parallel to the target-of-attachment surface. The parallel faces have engineering importance and usefulness for taking direct contact with target-of-attachment surfaces and mounting electronic elements, e.g. sensors or light emitters. These characteristics are expected to allow for the realization of flexible devices capable of sensing shear force or flow velocity parallel to object's surfaces.
KW - Extruded Miura-Ori
KW - Flexible electronic devices
KW - Origami
KW - Self-folding
UR - http://www.scopus.com/inward/record.url?scp=85083268850&partnerID=8YFLogxK
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U2 - 10.1109/MEMS46641.2020.9056110
DO - 10.1109/MEMS46641.2020.9056110
M3 - Conference contribution
AN - SCOPUS:85083268850
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 909
EP - 912
BT - 33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020
Y2 - 18 January 2020 through 22 January 2020
ER -