Analyses of transient behaviors of no-insulation REBCO pancake coils during sudden discharging and overcurrent

Stability margin of a high-temperature superconducting (HTS) coil is two or three orders of magnitude greater than that of a low-temperature superconducting coil. In recent years, many papers have reported test results of turn-to-turn no-insulation (NI) HTS coils having extremely enhanced thermal stability, such that burnout never occurs in an NI coil, even at an operating current exceeding 2.5 times the critical current. Thus, The main goal of this paper is to clarify transient electromagnetic and thermal behaviors and mechanism of the high thermal stability in an NI REBCO coil. A partial element equivalent circuit (PEEC) model is proposed for the numerical simulation of an NI REBCO coil, which considers a local electrical contact resistance between turns, an $I\mbox{ - } V$ characteristic of an REBCO tape, and local self and mutual inductances of the NI REBCO coil. Using the PEEC model, we investigate the influence of the turn-to-turn contact resistance on the transient behavior of the NI REBCO coil during sudden discharging. We also perform thermal conduction analyses with the PEEC model to clarify the transient behavior of an NI REBCO coil during an overcurrent operation.