TY - JOUR
T1 - Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods
AU - Shi, Hongbin
AU - Che, F. X.
AU - Tian, Cuihua
AU - Zhang, Rui
AU - Park, Jong Tae
AU - Ueda, Toshitsugu
PY - 2012/9
Y1 - 2012/9
N2 - In this paper, we present the thermal cycling test results for edge and corner bonded lead-free PSvfBGAs on a high-T g test board. The test results show that the characteristic lives of PSvfBGAs with edge bond acrylic, edge bond epoxy and corner bond epoxy are respectively about 0.6, 0.9 and 1.3 times of the PSvfBGAs without bonding. The epoxy with lowest CTE, highest storage modulus and smallest adhesive volume yielded best performance. The 3D quarter finite element model was also built to further study the failure mechanism.
AB - In this paper, we present the thermal cycling test results for edge and corner bonded lead-free PSvfBGAs on a high-T g test board. The test results show that the characteristic lives of PSvfBGAs with edge bond acrylic, edge bond epoxy and corner bond epoxy are respectively about 0.6, 0.9 and 1.3 times of the PSvfBGAs without bonding. The epoxy with lowest CTE, highest storage modulus and smallest adhesive volume yielded best performance. The 3D quarter finite element model was also built to further study the failure mechanism.
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U2 - 10.1016/j.microrel.2012.06.089
DO - 10.1016/j.microrel.2012.06.089
M3 - Article
AN - SCOPUS:84866739030
SN - 0026-2714
VL - 52
SP - 1870
EP - 1875
JO - Microelectronics Reliability
JF - Microelectronics Reliability
IS - 9-10
ER -