抄録
Two catalytic systems for electroless metal deposition have been investigated by means of Rutherford backscattering spectrometry (RBS). The well-known tin sensitizer, palladium activator, two-step catalyst had the main emphasis, but also a commercial one based on evaporated palladium was examined. The behavior of the two-step catalyst was largely dependent on the substrates used. On A12O3, the Sn:Pd ratio was 1:1 with 1.3 x 1016 atoms/cm2 each. On carbon substrates, the Sn:Pd ratio was 1:4 with 6 × 1015 tin atoms/cm2 and 24 x 1015 palladium atoms/cm2. Both these results violate the simple reaction mechanism described by the equation Sn2+ + Pd2+→ Sn4+ + Pdo. The commercial catalyst on polyimide containing 2.5 × 1015 palladium atoms/cm2 on the surface behaved differently compared to the two-step catalyst by diffusing into the deposited layer and thereby influencing its deposition rate.
| 本文言語 | English |
|---|---|
| ページ（範囲） | 2252-2255 |
| ページ数 | 4 |
| ジャーナル | Journal of the Electrochemical Society |
| 巻 | 130 |
| 号 | 11 |
| DOI | |
| 出版ステータス | Published - 1983 11月 |
ASJC Scopus subject areas
- 電子材料、光学材料、および磁性材料
- 再生可能エネルギー、持続可能性、環境
- 表面、皮膜および薄膜
- 電気化学
- 材料化学
UN SDG
この成果は、次の持続可能な開発目標に貢献しています
