Bilayer Self-Folding Method with High Folding Force and Angle by Suppressing Delamination of Shrink Layer

Yusuke Sato, Takashi Sato, Eiji Iwase*

*この研究の対応する著者

研究成果: Article査読

抄録

Heat-shrinkable films commonly serve as active materials for self-folding owing to their capability to fold all hinges upon heating. For origami-based electronic devices, the self-folding of the metal layer is necessary. Nevertheless, the self-folding angle is low owing to the high bending stiffness of metal layers and the low adhesion of heat-shrinkable films. Here, we introduce a bilayer self-folding technique that effectively suppresses delamination of the shrink layer, thereby achieving a high folding force and angle. A polyolefin film mechanically fixed on the metal substrate serves to inhibit delamination, regardless of the adhesive properties of the shrink layer. This is achieved by applying adhesives within holes fabricated on the shrink layer. Conventional methods using an adhesive layer to fix the shrink layer lead to delamination at temperatures above 100°C, resulting in a decrease in self-folding angles. In contrast, our novel fixing method yields a folding angle of 161° at 140°C, with a shrinkage rate of 69%. To demonstrate the versatility of our proposed technique, we self-fold various origami structures, including Miura-ori, scissors, cranes, and tessellation with chip LEDs. The introduced method broadens the range of substrate materials suitable for self-folding and offers new possibilities for the development of origami devices.

本文言語English
ページ(範囲)908-914
ページ数7
ジャーナルIEEJ Transactions on Electrical and Electronic Engineering
19
5
DOI
出版ステータスPublished - 2024 5月

ASJC Scopus subject areas

  • 電子工学および電気工学

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