Breakdown mechanism of plasma polymerized ethylene thin film

研究成果: Conference article › 査読

本文言語	English
論文番号	763342
ページ（範囲）	102-107
ページ数	6
ジャーナル	Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
DOI	https://doi.org/10.1109/CEIDP.1991.763342
出版ステータス	Published - 1991 1月 1
イベント	1991 Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 1991 - Knoxville, United States 継続期間: 1991 10月 20 → 1991 10月 23

ASJC Scopus subject areas

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title = "Breakdown mechanism of plasma polymerized ethylene thin film",

author = "K. Ishii and Y. Ohki",

year = "1991",

month = jan,

day = "1",

doi = "10.1109/CEIDP.1991.763342",

language = "English",

pages = "102--107",

journal = "Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP",

issn = "0084-9162",

note = "1991 Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 1991 ; Conference date: 20-10-1991 Through 23-10-1991",

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T1 - Breakdown mechanism of plasma polymerized ethylene thin film

AU - Ishii, K.

AU - Ohki, Y.

PY - 1991/1/1

Y1 - 1991/1/1

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EP - 107

JO - Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP

JF - Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP

M1 - 763342

T2 - 1991 Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 1991

Y2 - 20 October 1991 through 23 October 1991

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