TY - JOUR
T1 - Cepstrum technique for multilayer structure characterization
AU - Lu, X. M.
AU - Reid, J. M.
AU - Soetanto, K.
AU - Weng, L.
AU - Genis, V.
PY - 1990
Y1 - 1990
N2 - The triple cepstrum, the third power of the inverse Fourier transform (IFT) of the logarithm of signal power spectrum, is used to characterize two-layer structures. The thickness of each layer can be found from the positions of the peaks in the triple cepstrum. Simulations and preliminary experiments have shown that the relative reflection coefficients can be reconstructed, in the ideal and lossless case, from the polarity and the amplitude of these peaks, as predicted by theory. The impedance pattern can be predicted even at low signal to noise ratio. A potential application of this method is to characterize blood vessel walls. The resulting thickness and impedance pattern could be useful in detecting and classifying plaques, particularly in the early stages.
AB - The triple cepstrum, the third power of the inverse Fourier transform (IFT) of the logarithm of signal power spectrum, is used to characterize two-layer structures. The thickness of each layer can be found from the positions of the peaks in the triple cepstrum. Simulations and preliminary experiments have shown that the relative reflection coefficients can be reconstructed, in the ideal and lossless case, from the polarity and the amplitude of these peaks, as predicted by theory. The impedance pattern can be predicted even at low signal to noise ratio. A potential application of this method is to characterize blood vessel walls. The resulting thickness and impedance pattern could be useful in detecting and classifying plaques, particularly in the early stages.
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M3 - Conference article
AN - SCOPUS:0025575219
SN - 0090-5607
VL - 3
SP - 1571
EP - 1574
JO - Ultrasonics Symposium Proceedings
JF - Ultrasonics Symposium Proceedings
T2 - Proceedings of the IEEE 1990 Ultrasonics Symposium
Y2 - 4 December 1990 through 7 December 1990
ER -