Comparison of dielectric properties among polydicyclopentadiene resin, epoxy resin and their composites with microsized SiO2 fillers

Yuki Masuzaki; Yoshimichi Ohki; Masahiro Kozako

doi:10.1109/ISEIM.2014.6870797

Comparison of dielectric properties among polydicyclopentadiene resin, epoxy resin and their composites with microsized SiO₂ fillers

Yuki Masuzaki, Yoshimichi Ohki, Masahiro Kozako

各務記念材料技術研究所

研究成果: Conference contribution

13 被引用数 (Scopus)

抄録

Complex permittivity spectra of polydicyclopenta-diene resin and epoxy resin, and their composites with SiO₂ microfiller were obtained in a wide temperature and frequency range. Both ε_r′ and ε_r″ at high temperatures above their glass transition temperatures (T_g's) are much lower in polydicyclopentadiene resin than in epoxy resin, even though the two T_g's are almost the same. Furthermore, analysis using electric modulus has revealed that addition of the microfiller in epoxy resin suppresses dipolar orientation and charge transport. However, both the dipolar orientation and charge transport seem to be difficult in polydicyclopentadien resin and its composite compared to epoxy resin and its composite.

本文言語	English
ホスト出版物のタイトル	Proceedings of 2014 International Symposium on Electrical Insulating Materials, ISEIM 2014
出版社	Institute of Electrical Engineers of Japan
ページ	374-377
ページ数	4
ISBN（印刷版）	9784886860866
DOI	https://doi.org/10.1109/ISEIM.2014.6870797
出版ステータス	Published - 2014
イベント	2014 International Symposium on Electrical Insulating Materials, ISEIM 2014 - Niigata, Japan 継続期間: 2014 6月 1 → 2014 6月 5

出版物シリーズ

名前	Proceedings of the International Symposium on Electrical Insulating Materials

Other

Other	2014 International Symposium on Electrical Insulating Materials, ISEIM 2014
国/地域	Japan
City	Niigata
Period	14/6/1 → 14/6/5

ASJC Scopus subject areas

電子工学および電気工学
電子材料、光学材料、および磁性材料

文献へのアクセス

10.1109/ISEIM.2014.6870797

他のファイルとリンク

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引用スタイル

Masuzaki, Y., Ohki, Y., & Kozako, M. (2014). Comparison of dielectric properties among polydicyclopentadiene resin, epoxy resin and their composites with microsized SiO₂ fillers. In Proceedings of 2014 International Symposium on Electrical Insulating Materials, ISEIM 2014 (pp. 374-377). 記事 6870797 (Proceedings of the International Symposium on Electrical Insulating Materials). Institute of Electrical Engineers of Japan. https://doi.org/10.1109/ISEIM.2014.6870797

Comparison of dielectric properties among polydicyclopentadiene resin, epoxy resin and their composites with microsized SiO₂ fillers. / Masuzaki, Yuki; Ohki, Yoshimichi; Kozako, Masahiro.
Proceedings of 2014 International Symposium on Electrical Insulating Materials, ISEIM 2014. Institute of Electrical Engineers of Japan, 2014. p. 374-377 6870797 (Proceedings of the International Symposium on Electrical Insulating Materials).

研究成果: Conference contribution

Masuzaki, Y, Ohki, Y & Kozako, M 2014, Comparison of dielectric properties among polydicyclopentadiene resin, epoxy resin and their composites with microsized SiO₂ fillers. in Proceedings of 2014 International Symposium on Electrical Insulating Materials, ISEIM 2014., 6870797, Proceedings of the International Symposium on Electrical Insulating Materials, Institute of Electrical Engineers of Japan, pp. 374-377, 2014 International Symposium on Electrical Insulating Materials, ISEIM 2014, Niigata, Japan, 14/6/1. https://doi.org/10.1109/ISEIM.2014.6870797

Masuzaki Y, Ohki Y, Kozako M. Comparison of dielectric properties among polydicyclopentadiene resin, epoxy resin and their composites with microsized SiO₂ fillers. In Proceedings of 2014 International Symposium on Electrical Insulating Materials, ISEIM 2014. Institute of Electrical Engineers of Japan. 2014. p. 374-377. 6870797. (Proceedings of the International Symposium on Electrical Insulating Materials). doi: 10.1109/ISEIM.2014.6870797

Masuzaki, Yuki ; Ohki, Yoshimichi ; Kozako, Masahiro. / Comparison of dielectric properties among polydicyclopentadiene resin, epoxy resin and their composites with microsized SiO₂ fillers. Proceedings of 2014 International Symposium on Electrical Insulating Materials, ISEIM 2014. Institute of Electrical Engineers of Japan, 2014. pp. 374-377 (Proceedings of the International Symposium on Electrical Insulating Materials).

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