Comparison of dielectric properties among polydicyclopentadiene resin, epoxy resin and their composites with microsized SiO₂ fillers

Engineering & Materials Science

• Dielectric properties 100%
• Epoxy resins 88%
• Fillers 78%
• Resins 74%
• Charge transfer 52%
• Composite materials 47%
• Glass transition 23%
• Superconducting transition temperature 22%
• Permittivity 20%
• Temperature 16%

Chemical Compounds

• Dielectric Property 82%
• Epoxy Resin 80%
• Filler 70%
• Composite Material 41%
• Charge Transfer 28%
• Permittivity 22%
• Glass Transition Temperature 17%