TY - CHAP
T1 - Compatibility of dielectric properties with other engineering performances
AU - Tanaka, Toshikatsu
AU - Shimizu, Toshio
AU - Kurimoto, Muneaki
AU - Ohki, Yoshimichi
AU - Kurokawa, Norio
AU - Okamoto, Kenji
PY - 2017/1/1
Y1 - 2017/1/1
N2 - Polymers naturally have low thermal conductivity. Polymer composites with practical high dielectric strength are required to have relatively high thermal conductivity. When polymers are loaded with high thermally conductive inorganic micro-fillers, 88resulting composites have high thermal conductivity due to percolation effect of micro-fillers. However, they often suffer from reduced dielectric breakdown strength. In order to overcome this reduction, a certain nanotechnology method has been explored using nanofillers.
AB - Polymers naturally have low thermal conductivity. Polymer composites with practical high dielectric strength are required to have relatively high thermal conductivity. When polymers are loaded with high thermally conductive inorganic micro-fillers, 88resulting composites have high thermal conductivity due to percolation effect of micro-fillers. However, they often suffer from reduced dielectric breakdown strength. In order to overcome this reduction, a certain nanotechnology method has been explored using nanofillers.
UR - http://www.scopus.com/inward/record.url?scp=85051831012&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85051831012&partnerID=8YFLogxK
U2 - 10.1201/9781315230740
DO - 10.1201/9781315230740
M3 - Chapter
AN - SCOPUS:85051831012
SN - 9789814745024
BT - Advanced Nanodielectrics
PB - Pan Stanford Publishing Pte. Ltd.
ER -