Cu-Cu direct bonding by introducing Au intermediate layer

Hirokazu Noma; Takumi Kamibayashi; Hiroyuki Kuwae; Naoya Suzuki; Toshihisa Nonaka; Shuichi Shoji; Jun Mizuno

doi:10.23919/LTB-3D.2017.7947466

Cu-Cu direct bonding by introducing Au intermediate layer

Hirokazu Noma, Takumi Kamibayashi, Hiroyuki Kuwae, Naoya Suzuki, Toshihisa Nonaka, Shuichi Shoji, Jun Mizuno

研究成果: Conference contribution

抄録

Cu-Cu direct bonding under help of direct immersion gold (DIG) for multi-die fan-out wafer level package was demonstrated. Cu-Cu direct bonding is a critical technology for high-frequency applications. To solve challenges of conventional methods, the DIG was used. As a result, a cohesion failure was obtained in shear test.

本文言語	English
ホスト出版物のタイトル	Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
出版社	Institute of Electrical and Electronics Engineers Inc.
ページ	70
ページ数	1
ISBN（電子版）	9784904743034
DOI	https://doi.org/10.23919/LTB-3D.2017.7947466
出版ステータス	Published - 2017 6月 13
外部発表	はい
イベント	5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 - Tokyo, Japan 継続期間: 2017 5月 16 → 2017 5月 18

出版物シリーズ

名前	Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017

Other

Other	5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
国/地域	Japan
City	Tokyo
Period	17/5/16 → 17/5/18

ASJC Scopus subject areas

電子工学および電気工学
産業および生産工学
電子材料、光学材料、および磁性材料
表面、皮膜および薄膜

文献へのアクセス

10.23919/LTB-3D.2017.7947466

他のファイルとリンク

引用スタイル

Noma, H., Kamibayashi, T., Kuwae, H., Suzuki, N., Nonaka, T., Shoji, S., & Mizuno, J. (2017). Cu-Cu direct bonding by introducing Au intermediate layer. In Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 (pp. 70). 記事 7947466 (Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/LTB-3D.2017.7947466

Cu-Cu direct bonding by introducing Au intermediate layer. / Noma, Hirokazu; Kamibayashi, Takumi; Kuwae, Hiroyuki その他.
Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 70 7947466 (Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017).

研究成果: Conference contribution

Noma, H, Kamibayashi, T, Kuwae, H, Suzuki, N, Nonaka, T, Shoji, S & Mizuno, J 2017, Cu-Cu direct bonding by introducing Au intermediate layer. in Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017., 7947466, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017, Institute of Electrical and Electronics Engineers Inc., pp. 70, 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017, Tokyo, Japan, 17/5/16. https://doi.org/10.23919/LTB-3D.2017.7947466

Noma H, Kamibayashi T, Kuwae H, Suzuki N, Nonaka T, Shoji S その他. Cu-Cu direct bonding by introducing Au intermediate layer. In Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc. 2017. p. 70. 7947466. (Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017). doi: 10.23919/LTB-3D.2017.7947466

Noma, Hirokazu ; Kamibayashi, Takumi ; Kuwae, Hiroyuki その他. / Cu-Cu direct bonding by introducing Au intermediate layer. Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 70 (Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017).

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Cu-Cu direct bonding by introducing Au intermediate layer

抄録

出版物シリーズ

Other

ASJC Scopus subject areas

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