TY - GEN
T1 - Cyclo-Olefin Polymer direct bonding using low temperature plasma activation bonding
AU - Mizuno, Jun
AU - Ishida, Hiroyuki
AU - Farrens, Sharron
AU - Dragoi, Viorel
AU - Shinohara, Hidetoshi
AU - Suzuki, Takafumi
AU - Ishizuka, Masanori
AU - Glinsner, Thomas
AU - Lindner, Friedrich P.
AU - Shoji, Shuichi
PY - 2005/11/9
Y1 - 2005/11/9
N2 - Low temperature direct bonding method of Cyclo-Olefm Polymer (COP) plates (20mm × 40mm × 2.0mm) has been developed employing surface plasma treatment with various gases such as N2, O2, and 10%-H2/Ar. Surface energy of the bonded interface has been measured by razor blade method. Reasonable bonding strength for flow devices was achieved even at room temperature. The contact angle measurement on the sample surfaces after plasma exposure indicated that the plasma activated surfaces became hydrophilic and this activated state lasted for longer than 2 months. This method is useful to fabricate micro-flow devices for single-molecule level optical bio-detection systems that requires less residual stress and deformation after bonding.
AB - Low temperature direct bonding method of Cyclo-Olefm Polymer (COP) plates (20mm × 40mm × 2.0mm) has been developed employing surface plasma treatment with various gases such as N2, O2, and 10%-H2/Ar. Surface energy of the bonded interface has been measured by razor blade method. Reasonable bonding strength for flow devices was achieved even at room temperature. The contact angle measurement on the sample surfaces after plasma exposure indicated that the plasma activated surfaces became hydrophilic and this activated state lasted for longer than 2 months. This method is useful to fabricate micro-flow devices for single-molecule level optical bio-detection systems that requires less residual stress and deformation after bonding.
KW - Activation
KW - Bonding
KW - COP
KW - Micro-channel
KW - Plasma
UR - http://www.scopus.com/inward/record.url?scp=27544515147&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=27544515147&partnerID=8YFLogxK
U2 - 10.1109/SENSOR.2005.1497330
DO - 10.1109/SENSOR.2005.1497330
M3 - Conference contribution
AN - SCOPUS:27544515147
SN - 0780389948
SN - 9780780389946
T3 - Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05
SP - 1346
EP - 1349
BT - TRANSDUCERS '05 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems - Digest of Technical Papers
T2 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05
Y2 - 5 June 2005 through 9 June 2005
ER -