TY - GEN
T1 - Design Optimization of Fin Shape of Heat Sinks for Enhanced Cooling Performance
AU - Igarashi, Hikaru
AU - Hirota, Masanori
AU - Yoshida, Makoto
AU - Miyashita, Tomoyuki
N1 - Funding Information:
ACKNOWLEDGMENT This work was supported by Council for Science, Technology and Innovation (CSTI), Cross-Ministerial Strategic Innovation Promotion Program (SIP), “Energy Systems of an Internet of Energy (IoE) Society” (JST).
Publisher Copyright:
© 2022 Japan Institute of Electronics Packaging.
PY - 2022
Y1 - 2022
N2 - Heat sinks are well-known mechanisms aiding to dissipate heat efficiently. In this study, we designed and evaluated the cooling performance of heat sinks with diverse fin geometries, base materials, and fans. Also, we optimized the performance by using design optimization of the variables related to the shape of fins. Thus, by changing the fin geometries of the heat sink, adding trenches to the straight fins, and the related modifications, it was found that the optimized heat sink achieves a higher cooling performance than the (baseline) straight-fin heat sink. We also investigated the relationship between the depth of the trench and the cooling performance to find the optimal parameters.
AB - Heat sinks are well-known mechanisms aiding to dissipate heat efficiently. In this study, we designed and evaluated the cooling performance of heat sinks with diverse fin geometries, base materials, and fans. Also, we optimized the performance by using design optimization of the variables related to the shape of fins. Thus, by changing the fin geometries of the heat sink, adding trenches to the straight fins, and the related modifications, it was found that the optimized heat sink achieves a higher cooling performance than the (baseline) straight-fin heat sink. We also investigated the relationship between the depth of the trench and the cooling performance to find the optimal parameters.
KW - Air-cooling
KW - Design Optimization
KW - Heat Sink
KW - Thermal Resistance
UR - http://www.scopus.com/inward/record.url?scp=85133389256&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85133389256&partnerID=8YFLogxK
U2 - 10.23919/ICEP55381.2022.9795403
DO - 10.23919/ICEP55381.2022.9795403
M3 - Conference contribution
AN - SCOPUS:85133389256
T3 - 2022 International Conference on Electronics Packaging, ICEP 2022
SP - 105
EP - 106
BT - 2022 International Conference on Electronics Packaging, ICEP 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 21st International Conference on Electronics Packaging, ICEP 2022
Y2 - 11 May 2022 through 14 May 2022
ER -