TY - GEN
T1 - Design optimization of heat sink using additive manufacturing
AU - Tateishi, Y.
AU - Parque, V.
AU - Miyashita, T.
AU - Gohara, H.
AU - Kato, R.
AU - Ikeda, Y.
N1 - Funding Information:
This paper is based on results obtained from a project subsidized by the New Energy and Industrial Technology Development Organization (NEDO), in Japan. The authors wish to thank Prof. Yoshida and Mr. Khairi at Waseda university support and guidance throughout this project.
Publisher Copyright:
© 2017 IEEE.
PY - 2017/12/26
Y1 - 2017/12/26
N2 - A new sink should be in simple shapes for reasonable manufacturing process. On the other hand, the heat sink tends to be complicated shape for high cooling performance. Recently, 3D printer is able to process complicated shapes. However, manufacturing cost by 3D printing method is expensive. Thus it is important to verify and improve fluid flow and thermal conductivity at the design stage of the heat sink. This study provides a simulation model and a new high performance heat sink by using finite element method and using optimization method. The new heat sink decreases the thermal resistance about 15% in comparison with the conventional one.
AB - A new sink should be in simple shapes for reasonable manufacturing process. On the other hand, the heat sink tends to be complicated shape for high cooling performance. Recently, 3D printer is able to process complicated shapes. However, manufacturing cost by 3D printing method is expensive. Thus it is important to verify and improve fluid flow and thermal conductivity at the design stage of the heat sink. This study provides a simulation model and a new high performance heat sink by using finite element method and using optimization method. The new heat sink decreases the thermal resistance about 15% in comparison with the conventional one.
KW - 3D printer
KW - additive manufacturing
KW - design optimization
KW - finite element method
KW - heat sink
UR - http://www.scopus.com/inward/record.url?scp=85049251395&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85049251395&partnerID=8YFLogxK
U2 - 10.1109/ICSJ.2017.8240096
DO - 10.1109/ICSJ.2017.8240096
M3 - Conference contribution
AN - SCOPUS:85049251395
T3 - 2017 IEEE CPMT Symposium Japan, ICSJ 2017
SP - 91
EP - 94
BT - 2017 IEEE CPMT Symposium Japan, ICSJ 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2017 IEEE CPMT Symposium Japan, ICSJ 2017
Y2 - 20 November 2017 through 22 November 2017
ER -