TY - GEN
T1 - Design Optimization of power module structure for inductance reduction
AU - Akimoto, Masaki
AU - Yoshida, Makoto
AU - Miyashita, Tomoyuki
N1 - Funding Information:
ACKNOWLEDGMENT This work was supported by Council for S ience, Technology and Innovation (CTS I), Cross -ministerial
Funding Information:
This work was supported by Council for Science, Technology and Innovation (CSTI), Cross-ministerial Strategic Innovation Promotion Program (SIP), "Energy systems of an Internet of Energy (IoE) society" (Funding agency: JST).
Publisher Copyright:
© 2022 Japan Institute of Electronics Packaging.
PY - 2022
Y1 - 2022
N2 - There is an unintended inductance called stray inductance in the power module. For modules with a switching function, the inductance should be reduced to make power loss during overshoot smaller. In this experiment, design variables were defined as the structure of the module, and the inductance was calculated from design variables. The design optimization was performed by the response surface methodology. As a result of calculating the performance for the optimized structure, the inductance was confirmed to be reduced by 12.1% from the original structure. The contribution distribution of each design variable to the inductance was also obtained.
AB - There is an unintended inductance called stray inductance in the power module. For modules with a switching function, the inductance should be reduced to make power loss during overshoot smaller. In this experiment, design variables were defined as the structure of the module, and the inductance was calculated from design variables. The design optimization was performed by the response surface methodology. As a result of calculating the performance for the optimized structure, the inductance was confirmed to be reduced by 12.1% from the original structure. The contribution distribution of each design variable to the inductance was also obtained.
KW - D-optimal
KW - contribution analysis
KW - design optimization
KW - design variables
KW - response surface method
KW - stray inductance
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U2 - 10.23919/ICEP55381.2022.9795596
DO - 10.23919/ICEP55381.2022.9795596
M3 - Conference contribution
AN - SCOPUS:85133404442
T3 - 2022 International Conference on Electronics Packaging, ICEP 2022
SP - 153
EP - 154
BT - 2022 International Conference on Electronics Packaging, ICEP 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 21st International Conference on Electronics Packaging, ICEP 2022
Y2 - 11 May 2022 through 14 May 2022
ER -