Detection of ion migration in composites for printed circuit boards by the pulsed electroacoustic method

M. Natsui; Y. Echigo; T. Tanaka; Y. Ohki; T. Maeno

doi:10.1109/ISEIM.2008.4664459

Detection of ion migration in composites for printed circuit boards by the pulsed electroacoustic method

M. Natsui^*, Y. Echigo, T. Tanaka, Y. Ohki, T. Maeno

^*この研究の対応する著者

先進理工学部

研究成果: Paper › 査読

8 被引用数 (Scopus)

抄録

Pulsed electroacoustic (PEA) method is applied as a nondestructive technique to detect ion migration that progresses to the thickness direction in insulation composites for printed circuit boards. In both cases of a paper/phenol-resin composite and a glass/epoxy-resin composite, penetration of Cu migration into the bulk after aging was confirmed. Namely, a shift of the peak location of positive charge, which corresponds to the progress of migration in the aged composite, is observable by the PEA method.

本文言語	English
ページ	376-379
ページ数	4
DOI	https://doi.org/10.1109/ISEIM.2008.4664459
出版ステータス	Published - 2008 12月 31
イベント	2008 International Symposium on Electrical Insulating Materials, ISEIM 2008 - Yokkaichi, Japan 継続期間: 2008 9月 7 → 2008 9月 11

Conference

Conference	2008 International Symposium on Electrical Insulating Materials, ISEIM 2008
国/地域	Japan
City	Yokkaichi
Period	08/9/7 → 08/9/11

ASJC Scopus subject areas

電子工学および電気工学
電子材料、光学材料、および磁性材料

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10.1109/ISEIM.2008.4664459

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AU - Natsui, M.

AU - Echigo, Y.

AU - Tanaka, T.

AU - Ohki, Y.

AU - Maeno, T.

PY - 2008/12/31

Y1 - 2008/12/31

N2 - Pulsed electroacoustic (PEA) method is applied as a nondestructive technique to detect ion migration that progresses to the thickness direction in insulation composites for printed circuit boards. In both cases of a paper/phenol-resin composite and a glass/epoxy-resin composite, penetration of Cu migration into the bulk after aging was confirmed. Namely, a shift of the peak location of positive charge, which corresponds to the progress of migration in the aged composite, is observable by the PEA method.

AB - Pulsed electroacoustic (PEA) method is applied as a nondestructive technique to detect ion migration that progresses to the thickness direction in insulation composites for printed circuit boards. In both cases of a paper/phenol-resin composite and a glass/epoxy-resin composite, penetration of Cu migration into the bulk after aging was confirmed. Namely, a shift of the peak location of positive charge, which corresponds to the progress of migration in the aged composite, is observable by the PEA method.

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T2 - 2008 International Symposium on Electrical Insulating Materials, ISEIM 2008

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Detection of ion migration in composites for printed circuit boards by the pulsed electroacoustic method

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Conference

ASJC Scopus subject areas

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