Effect of isothermal aging at 250°C on shear strength of joints using Au nanoporous bonding for die attach

H. Nishikawa; K. Matsunaga; M. S. Kim; M. Saito; J. Mizuno

doi:10.4071/2016-hitec-143

Effect of isothermal aging at 250°C on shear strength of joints using Au nanoporous bonding for die attach

H. Nishikawa, K. Matsunaga, M. S. Kim, M. Saito, J. Mizuno

ナノ・ライフ創新研究機構

研究成果: Paper › 査読

抄録

High-Temperature joining is a key technology for electronic component assembly and other high-Temperature applications. Recently, focusing on the sintering behavior of metal particles, the joining process using a nanoparticle paste has been proposed as an alternative to establish a high-Temperature joining technology. In this study, a feasibility study has been conducted to determine whether an Au nanoporous sheet can be used for joint material. We evaluated the effect of isothermal aging at 250 °C on shear strength of joints using an Au nanoporous sheet. The shear strength of the joint after isothermal storage at 250 °C for 1000h was more than 25 MPa.

本文言語	English
DOI	https://doi.org/10.4071/2016-hitec-143
出版ステータス	Published - 2016
イベント	IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016 - Albuquerque, United States 継続期間: 2016 5月 10 → 2016 5月 12

Conference

Conference	IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016
国/地域	United States
City	Albuquerque
Period	16/5/10 → 16/5/12

ASJC Scopus subject areas

電子工学および電気工学

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Nishikawa, H, Matsunaga, K, Kim, MS, Saito, M & Mizuno, J 2016, 'Effect of isothermal aging at 250°C on shear strength of joints using Au nanoporous bonding for die attach', Paper presented at IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016, Albuquerque, United States, 16/5/10 - 16/5/12. https://doi.org/10.4071/2016-hitec-143

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AU - Mizuno, J.

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Y1 - 2016

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Effect of isothermal aging at 250°C on shear strength of joints using Au nanoporous bonding for die attach

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