Effects of impurities on resistivity of electrodeposited high-Bs CoNiFe-based soft magnetic thin films

Tetsuya Osaka; Tokihiko Yokoshima; Takuya Nakanishi

doi:10.1109/20.950960

Effects of impurities on resistivity of electrodeposited high-B_s CoNiFe-based soft magnetic thin films

Tetsuya Osaka^*, Tokihiko Yokoshima, Takuya Nakanishi

^*この研究の対応する著者

研究成果: Conference article › 査読

15 被引用数 (Scopus)

抄録

Controlling the very small amount of inclusion of impurity elements by addition to the plating bath of various organic additives was found to be very effective in developing electrodeposited high-B_s CoNiFe soft magnetic thin films with desirably high resistivity. Included impurities were suggested to cause not only electron scattering but also decreasing grain size, both of which led to an increase of the resistivity. Chemical state of impurities was indicated to be controllable by selection of additives based on the functional group for adsorption.

本文言語	English
ページ（範囲）	1761-1763
ページ数	3
ジャーナル	IEEE Transactions on Magnetics
巻	37
号	4 I
DOI	https://doi.org/10.1109/20.950960
出版ステータス	Published - 2001 7月
イベント	8th Joint Magnetism and Magnetic Materials -International Magnetic Conference- (MMM-Intermag) - San Antonio, TX, United States 継続期間: 2001 1月 7 → 2001 1月 11

ASJC Scopus subject areas

電子材料、光学材料、および磁性材料
電子工学および電気工学

文献へのアクセス

10.1109/20.950960

他のファイルとリンク

引用スタイル

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title = "Effects of impurities on resistivity of electrodeposited high-Bs CoNiFe-based soft magnetic thin films",

abstract = "Controlling the very small amount of inclusion of impurity elements by addition to the plating bath of various organic additives was found to be very effective in developing electrodeposited high-Bs CoNiFe soft magnetic thin films with desirably high resistivity. Included impurities were suggested to cause not only electron scattering but also decreasing grain size, both of which led to an increase of the resistivity. Chemical state of impurities was indicated to be controllable by selection of additives based on the functional group for adsorption.",

keywords = "Electrodeposition, Impurities, Organic additives, Resistivity, Soft magnetic thin films",

author = "Tetsuya Osaka and Tokihiko Yokoshima and Takuya Nakanishi",

note = "Funding Information: This work was supported by the Research for the Future Project “Advanced Research and Development on High Density Magnetic Recording Devices by means of Atomic Interface Design” of the Japan Society for the Promotion of Science and by the Storage Research Consortium (SRC).; 8th Joint Magnetism and Magnetic Materials -International Magnetic Conference- (MMM-Intermag) ; Conference date: 07-01-2001 Through 11-01-2001",

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TY - JOUR

T1 - Effects of impurities on resistivity of electrodeposited high-Bs CoNiFe-based soft magnetic thin films

AU - Osaka, Tetsuya

AU - Yokoshima, Tokihiko

AU - Nakanishi, Takuya

N1 - Funding Information: This work was supported by the Research for the Future Project “Advanced Research and Development on High Density Magnetic Recording Devices by means of Atomic Interface Design” of the Japan Society for the Promotion of Science and by the Storage Research Consortium (SRC).

PY - 2001/7

Y1 - 2001/7

N2 - Controlling the very small amount of inclusion of impurity elements by addition to the plating bath of various organic additives was found to be very effective in developing electrodeposited high-Bs CoNiFe soft magnetic thin films with desirably high resistivity. Included impurities were suggested to cause not only electron scattering but also decreasing grain size, both of which led to an increase of the resistivity. Chemical state of impurities was indicated to be controllable by selection of additives based on the functional group for adsorption.

AB - Controlling the very small amount of inclusion of impurity elements by addition to the plating bath of various organic additives was found to be very effective in developing electrodeposited high-Bs CoNiFe soft magnetic thin films with desirably high resistivity. Included impurities were suggested to cause not only electron scattering but also decreasing grain size, both of which led to an increase of the resistivity. Chemical state of impurities was indicated to be controllable by selection of additives based on the functional group for adsorption.

KW - Electrodeposition

KW - Impurities

KW - Organic additives

KW - Resistivity

KW - Soft magnetic thin films

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