Effects of Surface Contaminants on Bonding Strength for Direct Cu-Cu Bonding with Passivation Layer

Alaric Yohei Kawai Pétillot; Shuichi Shoji; Hiroshi Kawarada; Jun Mizuno

doi:10.23919/ICEP58572.2023.10129767

Effects of Surface Contaminants on Bonding Strength for Direct Cu-Cu Bonding with Passivation Layer

Alaric Yohei Kawai Pétillot^*, Shuichi Shoji, Hiroshi Kawarada, Jun Mizuno

^*この研究の対応する著者

研究成果: Conference contribution

抄録

Cu bonding with an addition of an interfacial layer has been gaining attention for providing low-temperature bonding solutions for direct Cu bonding in advanced packaging. In this paper, Cu surfaces with an Au passivation layer were exposed to various dry surface treatments and analyzed by XPS to understand the effects of carbon contaminants on bonding strength. We have shown that VUV N2 treated samples improved the bonding strength and yield significantly compared to the bare samples as various carboxyl and carbonyl groups were removed from the bonding interface.

本文言語	English
ホスト出版物のタイトル	2023 International Conference on Electronics Packaging, ICEP 2023
出版社	Institute of Electrical and Electronics Engineers Inc.
ページ	31-32
ページ数	2
ISBN（電子版）	9784991191152
DOI	https://doi.org/10.23919/ICEP58572.2023.10129767
出版ステータス	Published - 2023
イベント	22nd International Conference on Electronics Packaging, ICEP 2023 - Kumamoto, Japan 継続期間: 2023 4月 19 → 2023 4月 22

出版物シリーズ

名前	2023 International Conference on Electronics Packaging, ICEP 2023

Conference

Conference	22nd International Conference on Electronics Packaging, ICEP 2023
国/地域	Japan
City	Kumamoto
Period	23/4/19 → 23/4/22

ASJC Scopus subject areas

電子工学および電気工学
産業および生産工学
材料力学
安全性、リスク、信頼性、品質管理
電子材料、光学材料、および磁性材料

文献へのアクセス

10.23919/ICEP58572.2023.10129767

他のファイルとリンク

引用スタイル

Pétillot, A. Y. K., Shoji, S., Kawarada, H., & Mizuno, J. (2023). Effects of Surface Contaminants on Bonding Strength for Direct Cu-Cu Bonding with Passivation Layer. In 2023 International Conference on Electronics Packaging, ICEP 2023 (pp. 31-32). (2023 International Conference on Electronics Packaging, ICEP 2023). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/ICEP58572.2023.10129767

Effects of Surface Contaminants on Bonding Strength for Direct Cu-Cu Bonding with Passivation Layer. / Pétillot, Alaric Yohei Kawai; Shoji, Shuichi; Kawarada, Hiroshi その他.
2023 International Conference on Electronics Packaging, ICEP 2023. Institute of Electrical and Electronics Engineers Inc., 2023. p. 31-32 (2023 International Conference on Electronics Packaging, ICEP 2023).

研究成果: Conference contribution

Pétillot, AYK, Shoji, S, Kawarada, H & Mizuno, J 2023, Effects of Surface Contaminants on Bonding Strength for Direct Cu-Cu Bonding with Passivation Layer. in 2023 International Conference on Electronics Packaging, ICEP 2023. 2023 International Conference on Electronics Packaging, ICEP 2023, Institute of Electrical and Electronics Engineers Inc., pp. 31-32, 22nd International Conference on Electronics Packaging, ICEP 2023, Kumamoto, Japan, 23/4/19. https://doi.org/10.23919/ICEP58572.2023.10129767

Pétillot AYK, Shoji S, Kawarada H, Mizuno J. Effects of Surface Contaminants on Bonding Strength for Direct Cu-Cu Bonding with Passivation Layer. In 2023 International Conference on Electronics Packaging, ICEP 2023. Institute of Electrical and Electronics Engineers Inc. 2023. p. 31-32. (2023 International Conference on Electronics Packaging, ICEP 2023). doi: 10.23919/ICEP58572.2023.10129767

Pétillot, Alaric Yohei Kawai ; Shoji, Shuichi ; Kawarada, Hiroshi その他. / Effects of Surface Contaminants on Bonding Strength for Direct Cu-Cu Bonding with Passivation Layer. 2023 International Conference on Electronics Packaging, ICEP 2023. Institute of Electrical and Electronics Engineers Inc., 2023. pp. 31-32 (2023 International Conference on Electronics Packaging, ICEP 2023).

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abstract = "Cu bonding with an addition of an interfacial layer has been gaining attention for providing low-temperature bonding solutions for direct Cu bonding in advanced packaging. In this paper, Cu surfaces with an Au passivation layer were exposed to various dry surface treatments and analyzed by XPS to understand the effects of carbon contaminants on bonding strength. We have shown that VUV N2 treated samples improved the bonding strength and yield significantly compared to the bare samples as various carboxyl and carbonyl groups were removed from the bonding interface.",

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PY - 2023

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AB - Cu bonding with an addition of an interfacial layer has been gaining attention for providing low-temperature bonding solutions for direct Cu bonding in advanced packaging. In this paper, Cu surfaces with an Au passivation layer were exposed to various dry surface treatments and analyzed by XPS to understand the effects of carbon contaminants on bonding strength. We have shown that VUV N2 treated samples improved the bonding strength and yield significantly compared to the bare samples as various carboxyl and carbonyl groups were removed from the bonding interface.

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Effects of Surface Contaminants on Bonding Strength for Direct Cu-Cu Bonding with Passivation Layer

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出版物シリーズ

Conference

ASJC Scopus subject areas

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