Efficient delay-matching bus routing by using multi-layers

Yang Tian, Ran Zhang, Takahiro Watanabe

研究成果: Conference contribution

2 被引用数 (Scopus)

抄録

Recently, signal propagation delay in a circuit implemented in VLSI or PCB becomes a very important problem due to the increasing clock frequency, where signal delay should be adjusted to meet the requirement of the delay time. The delay can be roughly estimated by the net length.While, due to the circuit complexity and the high density of integration, a single layer routing may not be enough for delay estimation. In current research, there's an algorithm for length matching bus routing for signal delay which has high efficiency. However, it doesn't put the high density of integration into consideration. The purpose of this paper is to route several nets by using multiple layers on a high density board to meet the signal delay requirement, even if there exist obstacles in the routing area. Previous research put focus on the single layer routing without considering the complexity and density of the board. In this paper, the complexity and density are taken into account. In our proposed algorithm, the routing area is divided into subareas to solve the problem efficiently, and nets can be assigned to the proper layers to avoid obstacles. After the net assignment, path generation is executed. Then, some optimizations are made to meet the signal delay for each net. Finally, the routing paths of nets which satisfy the delay constraint are determined. Experimental results using several examples show that our proposed method is highly effective and efficient.

本文言語English
ホスト出版物のタイトル2014 International Conference on Electronics Packaging, ICEP 2014
出版社IEEE Computer Society
ページ728-731
ページ数4
ISBN(印刷版)9784904090107
DOI
出版ステータスPublished - 2014 1月 1
イベント2014 International Conference on Electronics Packaging, ICEP 2014 - Toyama, Japan
継続期間: 2014 4月 232014 4月 25

出版物シリーズ

名前2014 International Conference on Electronics Packaging, ICEP 2014

Conference

Conference2014 International Conference on Electronics Packaging, ICEP 2014
国/地域Japan
CityToyama
Period14/4/2314/4/25

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料

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