Electrochemical Deposition Process for ULSI Interconnection Devices

Tetsuya Osaka; Masahiro Yoshino

doi:10.1002/9780470602638.ch13

Electrochemical Deposition Process for ULSI Interconnection Devices

Tetsuya Osaka^*, Masahiro Yoshino

^*この研究の対応する著者

ナノ・ライフ創新研究機構

研究成果: Chapter

3 被引用数 (Scopus)

本文言語	English
ホスト出版物のタイトル	Modern Electroplating
ホスト出版物のサブタイトル	Fifth Edition
出版社	John Wiley and Sons
ページ	369-382
ページ数	14
ISBN（印刷版）	9780470167786
DOI	https://doi.org/10.1002/9780470602638.ch13
出版ステータス	Published - 2011 2月 24

ASJC Scopus subject areas

化学 (全般)

文献へのアクセス

10.1002/9780470602638.ch13

他のファイルとリンク

引用スタイル

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title = "Electrochemical Deposition Process for ULSI Interconnection Devices",

keywords = "Copper deposition, interconnection by electrochemical techniques - copper trench filling by electrodeposition, Electrochemical deposition process for ULSI interconnection devices, Electroless process for ULSI interconnect fabrication process - fabricating diffusion barrier layers, by electrochemical deposition technique",

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