TY - GEN
T1 - Evaluation of anisotropic biaxial stress in Si1-xGex/Ge mesa-structure by oil-immersion raman spectroscopy
AU - Yamamoto, S.
AU - Takeuchi, K.
AU - Yokogawa, R.
AU - Tomita, M.
AU - Kosemura, D.
AU - Usuda, K.
AU - Ogura, A.
N1 - Publisher Copyright:
© The Electrochemical Society.
Copyright:
Copyright 2020 Elsevier B.V., All rights reserved.
PY - 2015
Y1 - 2015
N2 - Si1-xGex is one of the prospective materials for the next-generation transistors due to its high carrier mobility, especially for high Ge concentration Si1-xGex. Inducing strain in the Si1-xGex leads to transistor performance improvement, however it is difficult to evaluate strain induced in the channel region because the strained Si1-xGex channel may be scaled down to nanosize and relaxed complicatedly. We adopted oil-immersion Raman spectroscopy to evaluate the stress in the Si1-xGex nanostructure. In this technique, the anisotropic biaxial stress state in the Si1-xGex nanostructure can be evaluated. As a result, the nanostructure size dependence of the biaxial stress states in the Si1-xGex mesa structure on the Ge substrates was obtained, which was confirmed for the Si1-xGex with 76, 85, 92% Ge concentrations.
AB - Si1-xGex is one of the prospective materials for the next-generation transistors due to its high carrier mobility, especially for high Ge concentration Si1-xGex. Inducing strain in the Si1-xGex leads to transistor performance improvement, however it is difficult to evaluate strain induced in the channel region because the strained Si1-xGex channel may be scaled down to nanosize and relaxed complicatedly. We adopted oil-immersion Raman spectroscopy to evaluate the stress in the Si1-xGex nanostructure. In this technique, the anisotropic biaxial stress state in the Si1-xGex nanostructure can be evaluated. As a result, the nanostructure size dependence of the biaxial stress states in the Si1-xGex mesa structure on the Ge substrates was obtained, which was confirmed for the Si1-xGex with 76, 85, 92% Ge concentrations.
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U2 - 10.1149/06604.0039ecst
DO - 10.1149/06604.0039ecst
M3 - Conference contribution
AN - SCOPUS:84931445325
T3 - ECS Transactions
SP - 39
EP - 45
BT - Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 5
A2 - Roozeboom, F.
A2 - Narayanan, V.
A2 - Kakushima, K.
A2 - Timans, P. J.
A2 - Gusev, E. P.
A2 - Karim, Z.
A2 - DeGendt, S.
PB - Electrochemical Society Inc.
T2 - Symposium on Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 5 - 227th ECS Meeting
Y2 - 24 May 2015 through 28 May 2015
ER -