Fabrication of 3-D micromesh ni structures using electroplating

Hironobu Sato; Toshiharu Otsuka; Shuichi Shoji

Fabrication of 3-D micromesh ni structures using electroplating

Hironobu Sato^*, Toshiharu Otsuka, Shuichi Shoji

^*この研究の対応する著者

基幹理工学部

研究成果: Paper › 査読

抄録

This paper presents the fabrication method of 3-D Ni micromesh structures. Inverse-micromesh photoresist structures, fabricated by multiple inclined backside exposure, were used as molds for Ni electroplating. Ni micromeshes of about 3μm in diameter were realized by this method. This structure is useful for increasing the surface area of micro metal electrodes.

本文言語	English
ページ	26-30
ページ数	5
出版ステータス	Published - 2004 12月 1
イベント	Microfabricated Systems and MEMS VII - Proceedings of the International Symposium - Honolulu, HI, United States 継続期間: 2004 10月 3 → 2004 10月 8

Conference

Conference	Microfabricated Systems and MEMS VII - Proceedings of the International Symposium
国/地域	United States
City	Honolulu, HI
Period	04/10/3 → 04/10/8

ASJC Scopus subject areas

工学（全般）

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引用スタイル

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title = "Fabrication of 3-D micromesh ni structures using electroplating",

abstract = "This paper presents the fabrication method of 3-D Ni micromesh structures. Inverse-micromesh photoresist structures, fabricated by multiple inclined backside exposure, were used as molds for Ni electroplating. Ni micromeshes of about 3μm in diameter were realized by this method. This structure is useful for increasing the surface area of micro metal electrodes.",

author = "Hironobu Sato and Toshiharu Otsuka and Shuichi Shoji",

year = "2004",

month = dec,

day = "1",

language = "English",

pages = "26--30",

note = "Microfabricated Systems and MEMS VII - Proceedings of the International Symposium ; Conference date: 03-10-2004 Through 08-10-2004",

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TY - CONF

T1 - Fabrication of 3-D micromesh ni structures using electroplating

AU - Sato, Hironobu

AU - Otsuka, Toshiharu

AU - Shoji, Shuichi

PY - 2004/12/1

Y1 - 2004/12/1

N2 - This paper presents the fabrication method of 3-D Ni micromesh structures. Inverse-micromesh photoresist structures, fabricated by multiple inclined backside exposure, were used as molds for Ni electroplating. Ni micromeshes of about 3μm in diameter were realized by this method. This structure is useful for increasing the surface area of micro metal electrodes.

AB - This paper presents the fabrication method of 3-D Ni micromesh structures. Inverse-micromesh photoresist structures, fabricated by multiple inclined backside exposure, were used as molds for Ni electroplating. Ni micromeshes of about 3μm in diameter were realized by this method. This structure is useful for increasing the surface area of micro metal electrodes.

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UR - http://www.scopus.com/inward/citedby.url?scp=17044389010&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:17044389010

SP - 26

EP - 30

T2 - Microfabricated Systems and MEMS VII - Proceedings of the International Symposium

Y2 - 3 October 2004 through 8 October 2004

ER -

Fabrication of 3-D micromesh ni structures using electroplating

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Conference

ASJC Scopus subject areas

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