@inproceedings{7ddf521c79dc4b36ab22edf1b88f8035,
title = "Fabrication of a hermetic sealing device having I-structure TGV filled with submicron gold particles",
abstract = "We propose a hermetic sealing of a glass-to-glass structure which has an I-structure through-glass interconnect via (TGV) filled with submicron Au particles. A TGV sandwiched between two Au bumps is defined as I-structure TGV. The I-structure TGV was formed by the use of simple filling process with a resist hole and a vacuum condition. The samples were bonded at 200 °C under the vacuum of 0.50 Pa by using a low temperature Au/Au bonding pretreated with vacuum ultraviolet irradiation in the presence of oxygen gas (VUV/O3). The bonded samples showed He leakage rates of less than 5.0 × 10-9 Pa·m3 s-x1, which is the rejection limit defined by the MIL-STD-883G specification. This result indicates that proposed I-structure TGV is useful for a hermetic sealing device.",
keywords = "3-D integration, Au-Au bonding, Glass-to-glass structure, Gold particles, HF wet etching, Hermetic sealing, Low temperature bonding, VUV/O3 treatment",
author = "Kazuya Nomura and Akiko Okada and Shuichi Shoji and Toshinori Ogashiwa and Jun Mizuno",
note = "Funding Information: This work is partly supported by Japan Ministry of Education, Culture, Sports Science and Technology (MEXT) Grant-in-Aid for Scientific Basic Research (S) No. 23226010 and Scientific Basic Research (B) No. 2528924. The authors thank for MEXT Nanotechnology Platform Support Project of Waseda University Publisher Copyright: {\textcopyright} 2015 IEEE.; 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 ; Conference date: 21-10-2015 Through 23-10-2015",
year = "2015",
month = dec,
day = "23",
doi = "10.1109/IMPACT.2015.7365176",
language = "English",
series = "2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "46--49",
booktitle = "2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings",
}