Fabrication of highly dimension controlled PMMA microchip by hot embossing and low temperature direct bonding

Hidetoshi Shinohara; Jun Mizuno; Fumihiko Kitagawa; Koji Otsuka; Shuichi Shoji

Fabrication of highly dimension controlled PMMA microchip by hot embossing and low temperature direct bonding

Hidetoshi Shinohara, Jun Mizuno, Fumihiko Kitagawa, Koji Otsuka, Shuichi Shoji

研究成果: Paper › 査読

抄録

In this paper, a PMMA (poly-methyl methacrylate) microchip, which has shallow dams of about 5 μm gaps, was fabricated and evaluated. Accurate dimension control of the micro-channels was realized by not only optimizing hot embossing conditions but also employing low temperature plasma activated bonding.

本文言語	English
ページ	158-160
ページ数	3
出版ステータス	Published - 2006 1月 1
イベント	10th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2006 - Tokyo, Japan 継続期間: 2006 11月 5 → 2006 11月 9

Conference

Conference	10th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2006
国/地域	Japan
City	Tokyo
Period	06/11/5 → 06/11/9

ASJC Scopus subject areas

化学工学（その他）
バイオエンジニアリング

他のファイルとリンク

引用スタイル

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title = "Fabrication of highly dimension controlled PMMA microchip by hot embossing and low temperature direct bonding",

abstract = "In this paper, a PMMA (poly-methyl methacrylate) microchip, which has shallow dams of about 5 μm gaps, was fabricated and evaluated. Accurate dimension control of the micro-channels was realized by not only optimizing hot embossing conditions but also employing low temperature plasma activated bonding.",

keywords = "Hot embossing, Polymer microchip, Surface activation bonding",

author = "Hidetoshi Shinohara and Jun Mizuno and Fumihiko Kitagawa and Koji Otsuka and Shuichi Shoji",

year = "2006",

month = jan,

day = "1",

language = "English",

pages = "158--160",

note = "10th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2006 ; Conference date: 05-11-2006 Through 09-11-2006",

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TY - CONF

T1 - Fabrication of highly dimension controlled PMMA microchip by hot embossing and low temperature direct bonding

AU - Shinohara, Hidetoshi

AU - Mizuno, Jun

AU - Kitagawa, Fumihiko

AU - Otsuka, Koji

AU - Shoji, Shuichi

PY - 2006/1/1

Y1 - 2006/1/1

N2 - In this paper, a PMMA (poly-methyl methacrylate) microchip, which has shallow dams of about 5 μm gaps, was fabricated and evaluated. Accurate dimension control of the micro-channels was realized by not only optimizing hot embossing conditions but also employing low temperature plasma activated bonding.

AB - In this paper, a PMMA (poly-methyl methacrylate) microchip, which has shallow dams of about 5 μm gaps, was fabricated and evaluated. Accurate dimension control of the micro-channels was realized by not only optimizing hot embossing conditions but also employing low temperature plasma activated bonding.

KW - Hot embossing

KW - Polymer microchip

KW - Surface activation bonding

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UR - http://www.scopus.com/inward/citedby.url?scp=84902472451&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:84902472451

SP - 158

EP - 160

T2 - 10th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2006

Y2 - 5 November 2006 through 9 November 2006

ER -

Fabrication of highly dimension controlled PMMA microchip by hot embossing and low temperature direct bonding

抄録

Conference

ASJC Scopus subject areas

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