TY - GEN
T1 - Fabrications of micro-channel device by hot emboss and direct bonding of PMMA
AU - Mizuno, J.
AU - Harada, T.
AU - Glinsner, T.
AU - Ishizuka, M.
AU - Edura, T.
AU - Tsutsui, K.
AU - Ishida, H.
AU - Shoji, S.
AU - Wada, Y.
PY - 2004/12/1
Y1 - 2004/12/1
N2 - We have fabricated and evaluated the mechanical, optical and fluidic characteristics a 50um wide and a 30um deep micro-channel device produced by hot emboss and direct bonding of PMMA plate with dimensions of 20mm x 20mm x 1mm. The fabricated micro-channel device was evaluated the bond strength, which was confirmed to be high enough for practical use as well as for quite severe cleaning conditions as ultrasonic cleaning in pure water. The optical loss around bonded interface was also evaluated and no increase in the light absorption was observed. The above results confirmed that the hot emboss and direct bonding technologies for micro-channel manufacturing using the PMMA plates realizes high performance micro channel devices.
AB - We have fabricated and evaluated the mechanical, optical and fluidic characteristics a 50um wide and a 30um deep micro-channel device produced by hot emboss and direct bonding of PMMA plate with dimensions of 20mm x 20mm x 1mm. The fabricated micro-channel device was evaluated the bond strength, which was confirmed to be high enough for practical use as well as for quite severe cleaning conditions as ultrasonic cleaning in pure water. The optical loss around bonded interface was also evaluated and no increase in the light absorption was observed. The above results confirmed that the hot emboss and direct bonding technologies for micro-channel manufacturing using the PMMA plates realizes high performance micro channel devices.
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M3 - Conference contribution
AN - SCOPUS:16244384619
SN - 0769521894
T3 - Proceedings - 2004 International Conference on MEMS, NANO and Smart Systems, ICMENS 2004
SP - 26
EP - 29
BT - Proceedings - 2004 International Conference on MEMS, NANO and Smart Systems, ICMENS 2004
A2 - Badawy, W.
A2 - Moussa, W.
T2 - Proceedings - 2004 International Conference on MEMS, NANO and Smart Systems, ICMENS 2004
Y2 - 25 August 2004 through 27 August 2004
ER -